| Allicdata Part #: | ATS21252-ND |
| Manufacturer Part#: |
ATS-12F-99-C2-R0 |
| Price: | $ 4.80 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-12F-99-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.36590 |
| 10 +: | $ 4.24494 |
| 25 +: | $ 4.00907 |
| 50 +: | $ 3.77332 |
| 100 +: | $ 3.53751 |
| 250 +: | $ 3.30168 |
| 500 +: | $ 3.06585 |
| 1000 +: | $ 3.00689 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management within the electronics industry has come a long way in the last few decades. With the integration of the digital age and its various applications into everyday life, the need for reliable and efficient technology heat sinks has become more prevalent than ever before. One of the most popular solutions for thermal management is the ATS-12F-99-C2-R0, a device created for thermal management and heat dissipation.
The ATS-12F-99-C2-R0 is deployed in a variety of applications, including those in the medical, automotive, industrial, computing, and communications sectors. It is a highly efficient and reliable heat dissipation solution that comes equipped with a variety of features such as a low profile form factor and robust design. The device has the ability to handle high-power applications with ease and efficiently dissipate heat that would normally be generated when utilizing various types of electronic components. The ATS-12F-99-C2-R0 can also be used to increase temperature stability within a system.
The ATS-12F-99-C2-R0 is designed with a variety of superior features that make it especially useful for a variety of applications. It is made out of high-grade aluminum and is designed to perform in even the most demanding thermal requirements. The multi-layer construction features a sturdy core and multiple heat dissipation fins that ensure optimal heat dissipation. The device is also designed with a low profile form factor that allows it to be easily incorporated into a variety of different configurations.
As the ATS-12F-99-C2-R0 was designed to be highly efficient as well as being easy to install, it has become the device of choice for many applications that require thermal management and high-performance cooling. Utilizing maximum airflow and convection current, the device is able to rapidly dissipate heat away from components. Its low profile form factor also allows it to be easily adapted into a variety of different configurations.
The device features an airguide system that affords optimal thermal management with its high-temperature capability of dissipating heat over an extended operating range. The airguide system is designed to direct cool air to the components that require additional cooling, allowing for maximum thermal balance within the system.
The ATS-12F-99-C2-R0 also comes with a variety of other features that make it especially useful for a variety of applications. It features a unique base design that allows for easy installation and maintenance. The device is also designed with a variety of mounting options that enable it to be easily incorporated into a variety of designs. The device is designed to operate in high-load conditions with minimal noise level.
With its unique features, the ATS-12F-99-C2-R0 has become a viable solution for a variety of thermal management needs. It has the ability to handle high-power applications with ease, as well as provide superior thermal control and efficiency when utilized in a variety of applications. With its low profile form factor and robust construction, the ATS-12F-99-C2-R0 is an ideal thermal solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference
ATS-12F-99-C2-R0 Datasheet/PDF