| Allicdata Part #: | ATS-13A-150-C1-R0-ND |
| Manufacturer Part#: |
ATS-13A-150-C1-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13A-150-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.30498 |
| 30 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks play a very important role in controlling the temperature of electronic devices. ATS-13A-150-C1-R0 is a type of heat sink that serves a variety of different applications and is used to provide a natural air convection system to dissipate the heat generated by electronic components. This type of heat sink is commonly used in industrial, automotive, telecom, consumer, and military applications.
This specific type of heat sink is composed of aluminum that has been anodized with a black oxide finish to provide a more durable and corrosion-resistant surface. It also has a ribbed structure on the surface to help promote air circulation. The maximum temperature it can handle is 149°C, with a maximum heat dissipation rate of 443 watts. It has a total length of 150 mm and employs a thermal resistance of 0.25°C/W.
The ATS-13A-150-C1-R0’s primary purpose is to dissipate the increase in heat generated by electronic components when they’re in use. This is done through a natural air convection system. The ridges of the heat sink are designed to create an area of convective heat loss, through which air is drawn in and released. The columns of the heat sink are designed to increase the internal convective heat loss area, as well as to improve the air circulation for more effective heat dissipation.
The heat sink also utilizes the principles of thermal conductivity and thermal radiation to achieve optimal thermal performance. This is done by transferring heat away from the surface of the component, away from its neighboring components, and out of the device through the heat sink. As the heat is drawn away from the component, it is then conducted to the surrounding environment or dissipated through the convective air current produced by the heat sink. This allows for better heat control, which provides more reliable and longer-lasting performance from the component.
In summary, the ATS-13A-150-C1-R0 thermal heat sink is a great solution for keeping electronic components cool. Its ribbed structure promotes effective air circulation, allowing for better thermal performance, and its anodized finish provides a durable and corrosion-resistant surface. It can handle temperatures up to 149°C and a maximum power dissipation rate of 443 watts, making it a great option for a variety of applications.
The specific data is subject to PDF, and the above content is for reference