ATS-13A-61-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS21808-ND

Manufacturer Part#:

ATS-13A-61-C2-R0

Price: $ 4.00
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13A-61-C2-R0 datasheetATS-13A-61-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.62880
10 +: $ 3.52800
25 +: $ 3.33194
50 +: $ 3.13589
100 +: $ 2.93990
250 +: $ 2.74390
500 +: $ 2.54791
1000 +: $ 2.49892
Stock 1000Can Ship Immediately
$ 4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 21.97°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are important parts in any electrical device system; they are used to control and dissipate heat. One such product is the ATS-13A-61-C2-R0 thermal heat sink, which is designed to provide effective cooling in high-power applications. The ATS-13A-61-C2-R0 is designed to provide a cost-effective, easy-to-implement solution for controlling heat generation in high-power applications. The ATS-13A-61-C2-R0 is an aluminum heat sink made up of an aluminum base plate with a number of fins, with a perforated top. The heat sink can be mounted onto slots of printed circuit boards or other similar substrates.

The aluminum base plate and fins are designed to dissipate heat by transferring heat from the high-power components onto the fins, and then to the atmosphere. The aluminum fins also act as a heat sink, absorbing heat from the components and dissipating it rapidly outwards. This long lasting, high-performance aluminum heat sink is capable of dissipating high-power components up to a dissipated power of 100W.

The ATS-13A-61-C2-R0 provides an excellent way of controlling heat in high-power applications due to its multiple layers of fins and low thermal resistance. The fins can also be tailored to the particular application, allowing designers to customize the heat sink for their specific application. The perforated top increases the cooling performance by increasing the surface area and allowing air to flow through the thermal fins more efficiently.

The ATS-13A-61-C2-R0 thermal heat sink is designed for use in a variety of applications. These applications include: industrial electronic systems, automotive electronics, computers, telecommunications systems, medical electronic systems, and more. The ATS-13A-61-C2-R0 is capable of dissipating heat up to a wattage of 100W, so it is highly reliable in applications where there is a large amount of heat generated.

The use of the ATS-13A-61-C2-R0 thermal heat sink ensures that the applications it is used in are reliable and efficient, by managing the heat generated by high-powered components. The heat sink is designed to reduce the overall temperature of the application by dissipating heat rapidly and efficiently. The perforated top of the ATS-13A-61-C2-R0 increases the cooling performance and provides a greater surface area for heat dissipation.

The ATS-13A-61-C2-R0 thermal heat sink is an outstanding choice for any application that requires efficient and reliable cooling of high-power components. The aluminum fins and perforations increase the cooling performance and make the heat sink highly durable. The heat sink is also customizable, enabling designers to tailor the fins to their particular application. With its robust design, reliable performance, and versatile application, the ATS-13A-61-C2-R0 thermal heat sink is the ideal choice for any system requiring efficient heat dissipation.

The specific data is subject to PDF, and the above content is for reference

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