ATS-13B-69-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS22014-ND

Manufacturer Part#:

ATS-13B-69-C2-R0

Price: $ 4.80
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X20MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13B-69-C2-R0 datasheetATS-13B-69-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.36590
10 +: $ 4.24494
25 +: $ 4.00907
50 +: $ 3.77332
100 +: $ 3.53751
250 +: $ 3.30168
500 +: $ 3.06585
1000 +: $ 3.00689
Stock 1000Can Ship Immediately
$ 4.8
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.51°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are widely used in many applications. The ATS-13B-69-C2-R0 is one of the most popular and widely used thermal dissipaters available. It is widely used in the power electronics industry, and is designed to move heat away from critical components such as power transistors and rectifiers.

The ATS-13B-69-C2-R0 is designed for flexible mounting, but many users also use it as a stand-alone product. The heat sink is composed of extruded aluminum sections with fused fins for maximum thermal performance. The fins are designed to passively draw heat away from the components, providing a reliable platform for system cooling.

When the ATS-13B-69-C2-R0 is used in power electronics, it is able to handle high thermal loads with an efficiency of up to 95%. To reduce cross-section size, the heat sink is designed to work in laminar air flow, which means that the air flow is evenly distributed, reducing turbulence. This minimizes air resistance and maximizes heat transfer.

Despite its robust construction, the ATS-13B-69-C2-R0 can be assembled and disassembled in a matter of minutes. The modular design makes assembly and reassembly easy, and this also makes the product highly reliable, reducing the chance of component failure. This also allows for easy replacement of components if necessary.

In addition to its efficiency, the ATS-13B-69-C2-R0 also allows for a variety of thermal management strategies. This includes fanless designs, active cooling, or passive natural convection. This allows users to adjust their cooling approach for their specific application.

Due to its robust construction, the ATS-13B-69-C2-R0 is designed for usage in high vibration systems such as automotive and aerospace applications. This heat sink is also constructed to withstand harsh environmental conditions, such as high temperatures and humidity. This makes it ideal for applications that require long-term thermal performance and low maintenance.

When it comes to thermal dissipation, the ATS-13B-69-C2-R0 is one of the most reliable and dependable heat dissipaters available. It is designed to provide efficient, flexible and reliable thermal management in a wide variety of applications, making it an ideal choice for many industries.

The specific data is subject to PDF, and the above content is for reference

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