| Allicdata Part #: | ATS-13C-100-C3-R0-ND |
| Manufacturer Part#: |
ATS-13C-100-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-100-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
The ATS-13C-100-C3-R0 thermal - heat sink is a compact, cost effective solution for thermal management in electronic applications. It provides consistent cooling performance while remaining economically priced and reliable. The heat sink features superior performance in a variety of applications.
Application Fields
The ATS-13C-100-C3-R0 heat sink is designed to provide cooling and temperature control for a variety of electronic components. These include processors, memories, power supplies, I/O controllers, and more. The heat sink offers superior thermal performance and reliability for all types of electronics.
The ATS-13C-100-C3-R0 heat sink will be used in many different applications. It is durable and able to withstand extreme environments, such as high temperatures, mechanical vibrations, and other harsh conditions. It is perfect for applications where thermal performance and stability are required.
It can be used in many applications, such as medical equipment, industrial machinery, and heavy-duty equipment, due to its compact size. The heat sink can also be used in automotive applications, providing reliable thermal management for electronic components inside automobiles.
Working Principle
The ATS-13C-100-C3-R0 heat sink uses a combination of materials and design to provide effective cooling. The heat sink utilizes large fins to maximize surface area for heat dissipation. The fins are made from highly thermally conductive aluminum material which allows for efficient heat transfer from the component to the fins. This enables the ATS-13C-100-C3-R0 heat sink to cool electronic components more effectively than other heat sinks.
The ATS-13C-100-C3-R0 also optimizes fan performance by improving airflow and reducing noise levels. The combination of large fins and a built-in fan ensures efficient cooling and minimal noise. The large fins also work to increase the air pressure and reduce turbulence within the airflow, resulting in smooth and quiet operation.
The ATS-13C-100-C3-R0 heat sink is designed to optimize thermal dissipation. The large fins help dissipate heat away from the component to the external environment. The heat sink’s design allows for more efficient cooling and superior performance for all types of electronic components.
Conclusion
The ATS-13C-100-C3-R0 thermal - heat sink is a cost-effective, reliable cooling and temperature control solution for all types of electronic applications. The heat sink’s combination of materials and design ensure superior performance and consistent cooling. With its high thermal performance, low noise levels, and durable construction, the ATS-13C-100-C3-R0 heat sink is the perfect choice for applications where thermal management and stability are required.
The specific data is subject to PDF, and the above content is for reference