ATS-13F-56-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	17.86°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to ATS-13F-56-C3-R0

The ATS-13F-56-C3-R0 is a thermal - heat sink designed for optimal cooling efficiency on a wide variety of different applications. The unit is a standard thermal - heat sink, but it does feature a unique design that allows it to be used in a variety of different applications. This makes it a versatile choice for those who need to balance their cooling requirements with a range of other factors.

Performance Characteristics

The main features of the ATS-13F-56-C3-R0 are its excellent cooling efficiency and its wide range of operating performance characteristics. The unit has a fully-automatic temperature control that allows it to match the temperature requirements of the application, and its design ensures a reliable operation across multiple operating environments. This makes the ATS-13F-56-C3-R0 a great option for those who require an efficient cooling solution.The ATS-13F-56-C3-R0’s design also features a low-profile construction that is constructed out of high-grade aluminum and plastic materials in order to minimize air leakage and increase cooling efficiency. This low-profile construction also helps the unit fit into compact spaces while still providing a high level of cooling efficiency.

Limitations of ATS-13F-56-C3-R0

Despite the many advantages of the ATS-13F-56-C3-R0, there are some limitations to consider when choosing this thermal - heat sink. The unit relies on air convection for cooling, so it can experience reduced cooling efficiency in warmer climates. Additionally, the low-profile construction does reduce the ATS-13F-56-C3-R0’s cooling performance in some applications, which can limit its effectiveness in certain environments.

Applications of ATS-13F-56-C3-R0

The ATS-13F-56-C3-R0 is designed to be used in a wide range of applications, including computers, electrical appliances, and other electronics. It can be used in a variety of enclosures for cooling high-powered systems, and it can also be used as a fan for very small electronics. In each of these applications, the unit’s excellent cooling efficiency ensures reliable operation and prevents temperature-related problems.

Working Principle of ATS-13F-56-C3-R0

The ATS-13F-56-C3-R0 operates on a simple yet effective principle: heat is transferred away from the source by convection. The design of the unit allows air to circulate around the cooling fins without any turbulence, and as the hot air gets expelled, the cooler air is drawn in and the cycle continues. The unit is designed to work efficiently in any environment, making it a great choice for cooling applications.

Conclusion

The ATS-13F-56-C3-R0 is a thermal - heat sink that offers reliable cooling performance and excellent efficiency. Its low-profile construction and automatic temperature control make it a great choice for those who need to balance cooling performance with size requirements. Additionally, the unit is designed to work efficiently in a variety of applications, making it a great choice for those who need efficient cooling in a range of different situations.

The specific data is subject to PDF, and the above content is for reference