ATS-14C-160-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.65°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal – Heat Sinks

Thermal – Heat Sinks are devices that are used to dissipate or spread heat from a component or device to its environment. Heat sinks are a type of thermal management devices that are used to help control and reduce temperature. Heat sinks are typically made up of several materials including aluminum, copper, ceramic, and graphite among other metals and/or alloys. Heat sinks can be found in any application where effective thermal management is important.

ATS-14C-160-C1-R0 Application Field and Working Principle

The ATS-14C-160-C1-R0 is a low-profile thermal – heat sink designed for applications that require exceptionally low-profile designs such as servers, rackmount applications, and telecommunications systems. The ATS-14C-160-C1-R0 is constructed from an extruded aluminum fin stock with a copper base and comes with a highly efficient Nickel-plating Nickel-Zinc alloy top fin cover. The unit is designed to deliver 0.8K/W thermal resistance when tested for temperature measurements in a 22°C ambient environment.The ATS-14C-160-C1-R0 is designed with an optimized combination of fin surface area, gap spacing and air flow that helps maximize the performance of the heat sink. During operation, the heat sink draws ambient air from the sides and bottom. This creates a natural buoyancy force that helps dissipate the heat to the environment quickly. The heat sink is also designed to be low-maintenance, with thin fins spaced tightly together for maximum efficiency.

Benefits of the ATS-14C-160-C1-R0

The ATS-14C-160-C1-R0 provides several benefits for applications requiring low-profile thermal – heat sink solutions. The unit is designed for optimal heat transfer with its high surface area fin ratios and copper base. The copper base also helps provide a low thermal resistance, achieving 0.8K/W when tested in a 22°C ambient environment.The Nickel-plating Nickel-Zinc alloy fin cover helps provide superior corrosion resistance and strength, while promoting greater durability. The low-profile design makes the ATS-14C-160-C1-R0 suitable for use in a variety of applications that require a thin profile design. The thin, tightly spaced fins help maximize air flow and provide maximum cooling efficiency, eliminating the need for maintenance and cleaning.

Conclusion

The ATS-14C-160-C1-R0 is an effective and efficient Thermal – Heat Sink solution designed for applications requiring low-profile designs. The unit features a low thermal resistance when tested in a 22°C ambient environment, an optimized fin design for maximum air flow, and a highly durable Nickel-plating Nickel-Zinc alloy fin cover for superior corrosion resistance and strength. The ATS-14C-160-C1-R0 is an ideal solution for applications requiring an efficient and low-profile thermal – heat sink.

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