| Allicdata Part #: | ATS24377-ND |
| Manufacturer Part#: |
ATS-14F-56-C2-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14F-56-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.56580 |
| 10 +: | $ 3.47004 |
| 25 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are the most effective way of cooling high-performance electronic components and systems. The ATS-14F-56-C2-R0 is a highly efficient thermal heat sink that can be used in a variety of applications. In this article, we’ll explore the application field and working principle of the ATS-14F-56-C2-R0 heat sink.
The ATS-14F-56-C2-R0 is a state-of-the-art, high-efficiency heat sink that has been designed for the purpose of dissipating large amounts of heat generated by electronic components with high thermal loads. It is especially suited for use in applications that require continuous operation, such as those in aerospace, defense, and industrial applications. The ATS-14F-56-C2-R0 is rated for use in temperatures from -40ºC to +125ºC, allowing for extensive use in harsh environments.
The ATS-14F-56-C2-R0 thermal heat sink is a single-piece fin construction, made of anodized aluminum. It has an overall size of 140mm x 56mm, with a wall thickness of 0.2mm. The fins of the heat sink are designed to be curved in an s-shape to maximize the surface area exposed to the surrounding air. This allows for maximum heat dissipation while ensuring that the heat sink remains lightweight.
The ATS-14F-56-C2-R0 thermal heat sink is also equipped with an integrated fan system. The fan system consists of a 12V DC brushless fan with a low noise level of 34dBA, and a maximum airflow rating of 2.8m3/min. The fan is designed to be used in combination with the heat sink’s fins, creating an air flow that helps dissipate the heat more efficiently. This allows the heat sink to effectively manage the heat generated by the electronic components it is used with.
The ATS-14F-56-C2-R0 thermal heat sink is highly efficient, and is designed to work with a variety of electronics components and systems. It is a great solution for applications that require continuous operation, and can be used in many industries, including aerospace, defense, and industrial applications. Its ability to dissipate large amounts of heat while remaining lightweight makes it an ideal choice for cooling electronics components with high thermal loads.
In conclusion, the ATS-14F-56-C2-R0 thermal heat sink is an efficient thermal solution that can be used in many applications. It is designed to be lightweight and highly efficient, allowing for effective dissipating of heat from high-performance electronic components and systems. The integrated fan system further improves efficiency by creating an air flow that dissipates the heat more quickly. This makes the ATS-14F-56-C2-R0 an ideal thermal solution for a wide variety of industries and applications.
The specific data is subject to PDF, and the above content is for reference