ATS-15E-150-C3-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are an important part of modern technology. In order to keep all electronic equipment functioning properly, it is essential to dissipate heat efficiently. The ATS-15E-150-C3-R0 is a versatile heat sink that can effectively cool your electronics without sacrificing space. In this article, we will discuss the application field and working principle of the ATS-15E-150-C3-R0.

Application Field

The ATS-15E-150-C3-R0 is used primarily for cooling down integrated circuits, high-speed digital components, and other devices that require efficient heat dissipation. It is applicable for a wide range of products, including memory chips, graphics cards, GPUs, CPUs, and ASICs (application specific integrated circuits). The ATS-15E-150-C3-R0 is also suitable for appliances like computers, laptops, and other electronics. With its unique design and performance, the ATS-15E-150-C3-R0 can easily fit into any restricted space.

Working Principle of ATS-15E-150-C3-R0

The ATS-15E-150-C3-R0 uses a highly efficient aluminum extrusion technology for heat dissipation. This technology involves extruding aluminum to create heat sink fins that allow heat to be dissipated quickly and efficiently. The aluminum heat sink fins are attached to the heat sink base, where they form an array of fins that can be positioned to absorb and dissipate heat. In addition, the base of the ATS-15E-150-C3-R0 is coated with a heat-resistant adhesive that helps to maintain uniform temperature throughout the heat sink. The fins also distribute heat more effectively, increasing cooling efficiency.

This heat sink also features a unique design that ensures maximum drainage of thermal energy from the device. The base of the ATS-15E-150-C3-R0 has multiple channels that create a path for the heat to escape. This helps to minimize any potential thermal buildup that could otherwise occur. Furthermore, the ATS-15E-150-C3-R0 is designed with a copper core that ensures efficient heat transfer. The high thermal conductivity of the copper core also ensures that the heat is quickly dissipated.

The ATS-15E-150-C3-R0 is designed with a high-quality fan that ensures proper airflow throughout the device. This fan directs air past the fins, which increases the circulation of heat. This increased circulation helps to cool down the device more efficiently than other heat sinks with a single fan. Furthermore, the ATS-15E-150-C3-R0 features adjustable screws that help to fine-tune the fan speed for increased cooling performance.

Conclusion

The ATS-15E-150-C3-R0 is a versatile and efficient heat sink that can be used for a variety of applications. It is an excellent choice for cooling down integrated circuits, high-speed digital components, and other devices that require efficient heat dissipation. Additionally, the ATS-15E-150-C3-R0 features a high-quality fan, efficient aluminum extrusion technology, and adjustable screws that ensure optimal cooling performance. With its unique design and performance, the ATS-15E-150-C3-R0 is an excellent option for any electronics heat dissipation needs.

The specific data is subject to PDF, and the above content is for reference