| Allicdata Part #: | ATS26223-ND |
| Manufacturer Part#: |
ATS-15H-11-C2-R0 |
| Price: | $ 4.06 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-11-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.68550 |
| 10 +: | $ 3.58596 |
| 25 +: | $ 3.38663 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-15H-11-C2-R0 is widely-used Thermal Heat Sinks, applicable for many applications.
A Thermal Heat Sink is a device which is used to transfer the heat away from the hot components of a system, such as processors, lasers, etc. The Thermal Heat Sink takes the heat away from the warm component and dissipates it into the air. This is done by making use of the heat transfer properties of different materials like copper, aluminum, iron and plastic.
The ATS-15H-11-C2-R0 Heat Sink is typically made of Aluminum and Copper. The aluminum is used for its lightweight and excellent heat transfer properties, while the copper provides the heat dissipation rate that is needed for cooling the hot components. When these Heat Sinks are mounted to the component they provide a thermal bridge that allows heat to transfer from the hot component to the Heat Sink, and then dissipate it away from the component.
The working principle of ATS-15H-11-C2-R0 is simple and it starts with air flow. The air inside the Heat Sink moves around the component, and this air flow provides the cooling effect. As the air passes through the Heat Sink, the heat is absorbed from the component and transferred away from it. The air continues to move around the component, cooling it down as it absorbs more heat before it leaves the Heat Sink. This allows for efficient cooling of the component so that it can continue working safely and efficiently.
The ATS-15H-11-C2-R0 Heat Sink is most commonly used in applications such as computers and electronic components. Due to their lightweight and excellent heat transfer properties, these Heat Sinks can be used in a variety of different applications, including those in which high levels of heat dissipation are needed. In addition, Heat Sinks can also be used to protect sensitive components by dissipating the heat before it can cause any damages.
In conclusion, the ATS-15H-11-C2-R0 Heat Sink is a great choice for Thermal Heat Sinks applications. It boasts excellent heat transfer properties and light weight making it ideal for a variety of different applications. It is also extremely easy to install and use, which makes it especially popular among tech-savvy users.
The specific data is subject to PDF, and the above content is for reference