ATS-16D-07-C3-R0

Thermal management plays an important role in modern electronic systems and computers. The ATS-16D-07-C3-R0 heat sink is an essential piece of equipment used to dissipate heat emanating from processors, motherboards, or other components that generate heat during regular operation. By dissipating the heat through a system of transfer materials such as fins, a fan, or other airflow devices, the heat sink is able to keep internal components functioning within their limit temperature. Here we aim to provide a comprehensive introduction to the ATS-16D-07-C3-R0 heat sink and its working principles.

Application Fields

The ATS-16D-07-C3-R0 heat sink is designed for high-performance applications such as server-level motherboards, heated electronic components, and other high-heat generation components. Because of its powerful airflow capabilities, it can also be used to dissipate heat from heatsinks located in areas with difficult access. These include high-performance PCs, workstations, as well as more specialized industrial applications. This heat sink is suitable for both AMD and Intel-based processors and motherboards.

Thermal Design

The ATS-16D-07-C3-R0 is made of lightweight aluminum extrusion with a long, thin profile. This lightweight material enables the heat sink to dissipate heat more efficiently by providing greater thermal insulation than other materials. The heat sink’s fan also runs at lower speeds, reducing noise. The fan also features an extraction hood that helps reduce turbulence and losses generated by the fan’s exhaust.

The heat sink’s side fins are designed to provide an extensive area of ventilation, transferring the heat to a large portion of the aluminum frame quickly and efficiently. In addition, the frame is fitted with two copper heat pipes designed to move the heat away from the source. These heat pipes can dissipate heat up to 12 Watts.

Working Principle

The ATS-16D-07-C3-R0 possesses an asymmetrical design, focusing the heat of the processor at an acute angle towards the heatpipe. This angle enables the heat to be dissipated efficiently, moving away from the source. The second heatpipe draws heat from the backside of the processor, transporting heat away from the mainboard and other components. This helps keep the main components operating at normal temperatures during full load.

The fan portion of the heat sink is designed to move the heat away from the heat pipe by providing a constant airflow. The fan runs at lower speeds, enabling higher efficiency on the part of the heat sink. The fan is equipped with an airflow hood that reduces turbulence and losses due to the fan’s exhaust. This hood helps maximize airflow and reduces noise.

Conclusion

The ATS-16D-07-C3-R0 is an essential component in modern electronic systems that helps keep temperatures of internal components at their designated limits. By using lightweight materials and a design focused on efficiency, the heat sink is able to move heat away from source components quickly and effectively. The heat sink is compatible with both AMD and Intel processors and motherboards and is designed for both active and passive cooling. In conclusion, this heat sink is suitable for applications that require powerful airflow and efficient heat dissipation.