ATS-16D-181-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-16D-181-C1-R0-ND

Manufacturer Part#:

ATS-16D-181-C1-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16D-181-C1-R0 datasheetATS-16D-181-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.93°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-16D-181-C1-R0 thermal heat sink is a versatile and reliable component that is used in many applications. It is designed to dissipate heat away from critical components and assemblies in order to maintain their optimal operating temperatures. The ATS-16D-181-C1-R0 thermal heat sink is widely used in various industries, such as power, automotive, heavy equipment, aviation and telecommunications.

The ATS-16D-181-C1-R0 thermal heat sink is composed of a heat conductive base material, a cooling fan or heatsink, and an insulation layer. The base material helps to evenly disperse heat across the entire heatsink. The fan or heat sink then helps to draw hot air away from the base material, and the insulation layer ensures that heated air is evenly distributed throughout the entire component. The combination of these three components helps to cool the system and ensure its longevity and efficiency.

The ATS-16D-181-C1-R0 thermal heat sink has many uses in different applications. It is used for cooling CPUs, Graphics cards, motherboards, memory modules, hard drives, power supplies, and other components. It is also used in various industrial applications, to regulate critical components such as motors, bearings, and other assemblies. It is generally used in industries, but can also be used in residential and commercial applications.

The working principle of the ATS-16D-181-C1-R0 thermal heat sink is simple. The base material acts to evenly disperse the heat across the entire component and away from the critical components, where it then passes to the cooling fan or heat sink. The fan then pulls the hot air away from the base material and then out of the system. The insulation layer helps to ensure that the heated air is evenly distributed throughout the heatsink, further aiding in its cooling ability.

One of the main advantages of the ATS-16D-181-C1-R0 thermal heat sink is its efficient cooling ability. It is capable of dissipating large amounts of heat from components, while still maintaining their optimal temperatures. Its wide range of applications makes it a great choice for many different industries. Furthermore, its insulation layer ensures that heated air is evenly distributed throughout the entire heatsink, which helps it to keep temperatures well below their maximum recommended levels. This provides high levels of reliability and efficient cooling, even in extreme conditions.

The ATS-16D-181-C1-R0 thermal heat sink is a versatile and reliable component that provides efficient cooling in many different applications. Its high levels of thermal performance make it an ideal choice for both industrial and commercial applications. It is a cost-effective solution that helps to keep components running cool and efficient. Whether used in a system or in an assembly, its thermal performance and reliability make it a great option for many different applications.

The specific data is subject to PDF, and the above content is for reference

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