ATS-16E-102-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-16E-102-C3-R0-ND

Manufacturer Part#:

ATS-16E-102-C3-R0

Price: $ 5.15
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X35MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16E-102-C3-R0 datasheetATS-16E-102-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.63806
30 +: $ 4.38060
50 +: $ 4.12297
100 +: $ 3.86524
250 +: $ 3.60755
500 +: $ 3.34987
1000 +: $ 3.28546
Stock 1000Can Ship Immediately
$ 5.15
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.33°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

.

Thermal management is essential for any electronic device, as heat can be a major cause of degradation and malfunction. Heat sinks are used to dissipate heat generated by the device and provide a cooled environment for it to operate. The ATS-16E-102-C3-R0 heat sink is an integral component of any electronic device, and has both commercial and industrial applications.

The ATS-16E-102-C3-R0 heat sink is designed with a high efficiency powder-coated aluminum fin that helps to dissipate heat. In addition, the fins are also anodized and corrosion resistant to ensure high performance and long-lasting operation. The heat sink also features an epoxy-coated base that is designed with rounded corners to prevent structural fatigue. The sink also features a high temperature rubber gasket, which helps to reduce noise and vibration.

The ATS-16E-102-C3-R0 acts as a thermal reservoir, distributing heat away from the device in a uniform manner. Heat sinks are used to prevent overheating and increase the efficiency of the device, as well as provide improved performance. They can also distribute the heat generated in a uniform manner, ensuring that the device remains at the optimal temperature throughout operation.

The ATS-16E-102-C3-R0 heat sink works on a conduction cooling principle. Heat is dissipated by transferring the thermal energy generated by the device to the fins of the sink. Once the heat has been absorbed by the fins, the heat is then dissipated into the air, cooling down the device. The ATS-16E-102-C3-R0 is also equipped with a fan that assists in pushing the heated air outwards.

The ATS-16E-102-C3-R0 is suitable for a wide range of applications, including industrial control systems, audio and video equipment, electronic gaming, digital signage, and medical equipment. For these applications, the sink helps to control the temperature of the device operating environment, ensuring that it remains within the specified temperature range. The heat sink can also be used to cool down high-end processors that generate large amounts of heat.

The ATS-16E-102-C3-R0 heat sink is easy to install and can be mounted on a variety of different surfaces. The sink can also be used in combination with other components to further enhance the thermal efficiency of electronic devices. It is an extremely reliable heat sink, and is designed to operate in both commercial and industrial settings.

Heat sinks are an essential component for any electronic device, and the ATS-16E-102-C3-R0 is an ideal choice for a wide range of applications. The sink operates on a conduction cooling principle, dissipating heat in a uniform and efficient manner. It also features a rubber gasket and epoxy-coated base for improved performance and long-lasting operation. The sink is also designed for easy installation on any type of surface, making it an ideal choice for thermal management in commercial and industrial settings.

The specific data is subject to PDF, and the above content is for reference

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