| Allicdata Part #: | ATS-16E-57-C1-R0-ND |
| Manufacturer Part#: |
ATS-16E-57-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-16E-57-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-16E-57-C1-R0 is a thermal - heat sink for a wide variety of applications. This thermal - heat sink is designed to be efficient and reliable to handle high stress applications; such as power electronic components, circuit boards, medical and industrial electronics, and even automotive electronics.
The thermal - heat sink is composed of an aluminum mounting base, extruded fins, and an anodized aluminum fin. The aluminum mounting base provides superior strength for the thermal - heat sink. The extruded fins are designed to provide maximum cooling capacity for the application, while the anodized aluminum fin increase the surface area. This combination creates a highly efficient, and reliable thermal - heat sink.
The thermal - heat sink’s working principle is relatively simple. Heat from components on the board is dissipated from the electronics components, and the heat is then transferred to the thermal - heat sink’s fins. The fins act as an exchanger of the heat between the components and the atmosphere, resulting in an efficient cooling process.
The ATS-16E-57-C1-R0 thermal - heat sink is effective when used in applications with continuously changing high-stress loads. It offers exceptional heat dissipation efficiency, preventing components from overheating and reducing the risk of thermal-related damages. It is perfect for cooling applications from power electronics, medical, industrial electronics, and even automotive electronics.
The ATS-16E-57-C1-R0 thermal - heat sink also offers additional features that improve its performance. For example, it includes a variety of mounting options, allowing users to adapt it to their specific application. Additionally, its mechanical construction is designed to ensure that the thermal - heat sink is rugged and durable, even in extreme conditions. These features make it the perfect solution for any cooling application.
The ATS-16E-57-C1-R0 is a versatile and reliable thermal - heat sink that is perfect for a wide variety of applications. Its aluminum mounting base, extruded fins, and anodized aluminum fin ensure an efficient and reliable cooling process. Its additional features, such as various mounting options, make it a perfect solution for any cooling application.
The specific data is subject to PDF, and the above content is for reference
ATS-16E-57-C1-R0 Datasheet/PDF