ATS-17A-118-C1-R0

Thermal - Heat Sinks

The ATS-17A-118-C1-R0, commonly referred to as a "heat sink", is a crucial component of any electronic system. It is a heat dissipating device, designed to draw thermal energy away from electronic components, to be dissipated into the air. In order to effectively dissipate the heat, the heat sink employs a finned, metal body construction to maximize heat transfer. This body construction additionally allows the use of a fan, which further speeds up the heat-dissipation process.Heat sinks come in a variety of shapes and sizes, depending on their intended purpose and application. For example, the ATS-17A-118-C1-R0 is a compact heat sink that is intended for use with embedded processor systems. It features a 5-cm2 heat sink base, as well as an 8-cm2 aluminum finned surface, for maximum heat transfer performance. The fan attached to the heat sink is also designed for enhanced cooling, and includes a magnetic bearing for low noise operation.When it comes to application fields, the ATS-17A-118-C1-R0 is primarily used in high-performance embedded processor applications. It is designed to provide efficient cooling for overheating processors, and can be used in single-board systems, embedded processor design, and power-electronic systems. This heat sink is also highly versatile, and can be used in a variety of other applications such as in telecommunications, medical electronics, and industrial electronics.As far as working principle is concerned, the ATS-17A-118-C1-R0 comes with two cooling methods. The first is the aluminum fins which work to dissipate heat through thermal conduction. As the heat sink receives thermal energy from the embedded processor, it radiates the heat away from the processor towards the fins. The second cooling method is a fan, or air-flow apparatus, which further helps to dissipate the heat into the air. As air passes over the fins, the thermal energy is absorbed, and the resulting airflow cools the processor even further.At the end of the day, the ATS-17A-118-C1-R0 heat sink is a simple, yet effective, way to keep your embedded processor systems running cool and efficiently. Its compact construction and magnetic bearing fan helps to keep thermal energy at bay and maximizes heat transfer performance. With its versatile application fields, this heat sink is a must-have for any embedded electronics system.