ATS-17C-166-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17C-166-C1-R0-ND

Manufacturer Part#:

ATS-17C-166-C1-R0

Price: $ 3.08
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X15MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17C-166-C1-R0 datasheetATS-17C-166-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.77011
30 +: $ 2.69514
50 +: $ 2.54533
100 +: $ 2.39564
250 +: $ 2.24590
500 +: $ 2.17103
1000 +: $ 1.94643
Stock 1000Can Ship Immediately
$ 3.08
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.12°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

A Thermal - Heat Sink (ATSEC) is a device designed to dissipate heat from an enclosure to the outside environment. It is typically used in control systems for high power applications where efficient heat dissipation is essential. The ATSEC-17C-166-C1-R0 is a large heat sink capable of dissipating heat from high power applications and is suitable for medium to large sized enclosures. The ATSEC-17C-166-C1-R0 is designed for applications such as amplifiers, control systems, and other devices requiring efficient heat dissipation in order to maintain thermal stability.

The ATSEC-17C-166-C1-R0 is a two-stage multi-fin heat sink design, with a total height of 166mm (6.5 inches). The base plate is made from high-strength aluminum, which helps to dissipate the heat from the case. The fins are also made from aluminum, and they act as a heat dissipating device, transferring the heat to the air. The fins are spaced 2mm apart, so they are effective in transferring heat away from the case.

The ATSEC-17C-166-C1-R0 is designed to be mounted on a vertical surface, with the top of the heat sink facing up. The heat sink can be mounted using standard screws, or with a special clip system for greater stability. The heat sink is designed with a 160mm x 66mm single core cooling fan, providing effective airflow for cooling purposes. The fan can be set to run at a constant speed, or it can be electronically driven for more precise temperature control.

The ATSEC-17C-166-C1-R0 is designed to be used in a variety of applications, including control systems, energy systems, inverters, and other high power applications. It is suitable for enclosures ranging from small to large. The heat sink is highly efficient at dissipating heat and can be mounted vertically, horizontally, or even diagonally, in order to maximize thermal efficiency.

The ATSEC-17C-166-C1-R0 thermal heat sink works by absorbing heat from the enclosure and transferring it to the air. As the air cools, the heat is absorbed and dissipated by the fins. This dissipation of heat helps to maintain thermal stability in the enclosure. The fan helps to create airflow that circulates the air in the enclosure, further aiding in the dissipation of heat.

The ATSEC-17C-166-C1-R0 is a highly versatile thermal heat sink, suitable for a variety of applications. Its multi-fin design helps to dissipate heat more effectively, and the adjustable fan allows for precise temperature control. With its robust construction and efficient heat dissipation, the ATSEC-17C-166-C1-R0 is a great choice for those looking for effective and efficient heat dissipation.

The specific data is subject to PDF, and the above content is for reference

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