ATS-17D-23-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17D-23-C1-R0-ND

Manufacturer Part#:

ATS-17D-23-C1-R0

Price: $ 4.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X15MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17D-23-C1-R0 datasheetATS-17D-23-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.81717
30 +: $ 3.60507
50 +: $ 3.39293
100 +: $ 3.18087
250 +: $ 2.96881
500 +: $ 2.75675
1000 +: $ 2.70374
Stock 1000Can Ship Immediately
$ 4.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks: ATS-17D-23-C1-R0 Application Field and Working Principle

Heat sinks are used to dissipate heat from electrical and electronic components. Heat sinks are devices that absorb the heat generated by circuits, convert it into a form that can be dissipated away from the circuit, and thus keep the circuit and components from overheating. Heat sinks are an important part of any cooling system, and serve as a dissipater of energy that helps keep components cool and running smoothly.A typical heat sink, like the ATS-17D-23-C1-R0 from Hivista Technologies, is a component made up of fins spaced apart from each other to create a large surface area. Heat sinks often consist of an aluminum base plate that has channels, or “fins,” stamped or extruded into it. Each fin is designed to maximize surface area and increase heat dissipation. The ATS-17D-23-C1-R0 is a 17mm square heat sink with a 23mm fixture clearance, 3mm offset fixture, 1.4mm mounting cavity, and a round-shaped profile.The natural convection process that the ATS-17D-23-C1-R0 uses is quite simple. Any heat produced by the components is transferred to the heat sink through conduction or radiation. The heat then moves to the fins of the heat sink which increases the surface area, allowing for a larger surface area to dissipate the heat. Since air naturally rises, the heat dissipated by the fins causes air to move up the heat sink, creating a convection cycle. This process is known as natural convection.The effectiveness of a heat sink is determined by how effectively it can dissipate the heat generated by the components. To do this, it is necessary to understand the thermal properties of the material used to create the heat sink. The most common materials used in manufacturing heat sinks are aluminum, copper, stainless steel, or a combination of these materials. Aluminum is the most common material used, due to its light weight and low cost. Copper is the best at conducting and dissipating heat. Stainless steel is usually reserved for more specialized applications. A combination of these materials is often used in order to take advantage of the benefits of each material.The ATS-17D-23-C1-R0 is designed to dissipate heat efficiently, so it is important to consider the power dissipated by the device in order to ensure optimal performance. The amount of power that needs to be dissipated depends on the application. For low-power applications, the heat sink may be able to dissipate the heat without any additional cooling. For higher power applications, however, it may be necessary to use a fan or liquid cooling system to help dissipate the heat.When designing a cooling system, it is important to consider the thermal resistance of the system. The thermal resistance is defined as the amount of heat that needs to be dissipated per unit of time. The lower the thermal resistance, the more efficient and reliable the cooling system will be. The ATS-17D-23-C1-R0 has a low thermal resistance, which helps make it an effective heat sink.Heat sinks like the ATS-17D-23-C1-R0 are used in a wide variety of applications, from computers and gaming consoles to solar panels and LED lighting. As the demand for electronic products increases, heat sinks become more important. For this reason, engineers must take into account the thermal properties of the materials used in the design of heat sinks, such as aluminum or copper, and the power dissipated by the device in order to maximize efficiency.

The specific data is subject to PDF, and the above content is for reference

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