ATS-17G-120-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-17G-120-C3-R0-ND

Manufacturer Part#:

ATS-17G-120-C3-R0

Price: $ 3.79
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17G-120-C3-R0 datasheetATS-17G-120-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.44736
30 +: $ 3.35433
50 +: $ 3.16802
100 +: $ 2.98166
250 +: $ 2.79531
500 +: $ 2.70213
1000 +: $ 2.42260
Stock 1000Can Ship Immediately
$ 3.79
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.57°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are an essential component in many Electronic devices. A Heat Sink is a device that absorbs and dissipates the heat generated by an Electronic component or system in order to maintain a safe operating temperature. The ATS-17G-120-C3-R0 is a specifically designed Heat Sink designed to dissipate the heat generated by an Electronic component.

The ATS-17G-120-C3-R0 heat sink is an efficient and cost-effective way to manage thermals in different applications. It’s constructed with an aluminum body with an extrusion profile at the front and a copper and aluminum inter layer design at the back providing optimal heat management. It is rated to dissipate up to 120 Watts of Thermal power and operates within a temperature range of -55 to 125°Celsius. It is designed for applications in consumer electronics, automotive, medical, aviation, and military.

The application field of the ATS-17G-120-C3-R0 heat sink is quite extensive. It is often used in high-power electronic components such as power amplifiers, high-speed digital signal processors, high-speed CPUs, high-powered LEDs, and many more. Additionally, it is also suitable for use in military, medical, and aviation applications.

The working principle of the ATS-17G-120-C3-R0 is relatively straightforward. The device takes in the thermal energy generated by the device it is installed on, and dissipates it using passive cooling methods. It is designed with a high thermal conductivity of up to 20 W/mK, allowing it to transfer heat away from its point of installation rapidly. Additionally, it serves as a physical barrier between the device and the environment, preventing the heated air from entering the environment.

The ATS-17G-120-C3-R0 is designed to have a lifespan of up to 5 years, depending on the operating temperature. It has been tested to ensure good performance and optimal thermal management throughout its operating life and is a great choice for any application requiring a reliable and efficient thermal solution.

In conclusion, the ATS-17G-120-C3-R0 is a highly efficient heat sink designed to provide reliable and efficient thermal management in many applications. It is constructed with an aluminum body and an efficient copper and aluminum inter layer design, providing optimal heat transfer and dissipation. It has a high thermal conductivity and is rated to dissipate up to 120 Watts of Thermal power. Additionally, it is designed for use in a range of different applications, including consumer electronics, automotive, medical, aviation, and military applications. Finally, the device has an impressive 5-year lifespan, making it a great choice for any application requiring a reliable and efficient thermal solution.

The specific data is subject to PDF, and the above content is for reference

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