| Allicdata Part #: | ATS-18C-113-C3-R0-ND |
| Manufacturer Part#: |
ATS-18C-113-C3-R0 |
| Price: | $ 3.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18C-113-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.04353 |
| 30 +: | $ 2.96100 |
| 50 +: | $ 2.79657 |
| 100 +: | $ 2.63208 |
| 250 +: | $ 2.46758 |
| 500 +: | $ 2.38533 |
| 1000 +: | $ 2.13857 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are a type of heat transfer component designed to dissipate heat generated by ongoing electronic operations. By increasing the surface area of the heat transfer component, a Heat Sink can increase the rate at which heat is dissipated into the surrounding environment. The ATS-18C-113-C3-R0 is a type of Heat Sink designed for various applications, and has become an increasingly popular choice for engineers due to its cost-effectiveness, reliability and ease of use.
ATS-18C-113-C3-R0 Heat Sink is designed to be used in thermal management applications. It features a closely-packed all-metal construction design, making it robust and highly efficient in thermal energy transfer. With an overall surface area of 13” x 18”, it possesses high thermal conductivity, enabling increased efficiency and greater cooling capabilities. This makes it a great choice for thermal management needs such as automotive electronics, CPUs, graphics cards and high-power resistors.
The ATS-18C-113-C3-R0 also features a hydrophilic coating that helps to reduce thermal resistance and assists in enhancing heat dissipation. This coating helps to ensure that the transfer of thermal energy is rapid and effective. Additionally, the Heat Sink features pins in its construction to help to secure it firmly onto the target surface. This enables easier and stable attachment, so the component remains firmly in place during operation.
The working principle of the ATS-18C-113-C3-R0 Heat Sink lies in the fact that it distributes the heat generated by the components which it is attached to. The metal construction of the heat sink maximizes its surface area and exposes it to the surrounding environment. The hydrophilic coating helps to ensure that thermal resistance is minimized, enabling the heat sink to absorb and transfer thermal energy efficiently.
Being a versatile and reliable component, the ATS-18C-113-C3-R0 Heat Sink can be used in a variety of applications, such as automotive electronics, CPUs, graphics cards, and high power resistors. It is also ideal for circuit board and plastic enclosure applications, making it an ideal choice for a variety of thermal management needs.
The ATS-18C-113-C3-R0 Heat Sink is an excellent choice for engineers due to its cost-effectiveness, efficiency, and long-life reliability. Its close-knit design ensures an efficient transfer of thermal energy, and its pins help to secure the component firmly in place. Additionally, its hydrophilic coating helps to maximize thermal resistance, further improving its effectiveness in dissipating heat for a range of applications.
The specific data is subject to PDF, and the above content is for reference