| Allicdata Part #: | ATS-18C-14-C3-R0-ND |
| Manufacturer Part#: |
ATS-18C-14-C3-R0 |
| Price: | $ 4.08 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18C-14-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.71070 |
| 30 +: | $ 3.50469 |
| 50 +: | $ 3.29855 |
| 100 +: | $ 3.09242 |
| 250 +: | $ 2.88625 |
| 500 +: | $ 2.68010 |
| 1000 +: | $ 2.62856 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are essential components in any electronic device, regulating the temperature of the device and ensuring its safe and optimum performance. The ATS-18C-14-C3-R0 is a type of Thermal - Heat Sink and is a great example of a high-quality and highly efficient Thermal - Heat Sink. This Thermal - Heat Sink is designed to efficiently dissipate heat from high-powered electronics, providing a longer operating life and maximum efficiency for the device.
The ATS-18C-14-C3-R0 is a compact, low-profile Heat Sink with a short height profile of only 1.70 inches. It utilizes a high-performance aluminum body, signature heat-dissipating pattern, and aluminum fins. The unique pattern of aluminum fins helps to dissipate heat more efficiently, providing up to 20% more cooling performance than traditional Thermal - Heat Sink designs. The Thermal - Heat Sink is rated at 14 Watts of continuous cooling capacity, making it a very efficient Thermal - Heat Sink.
The ATS-18C-14-C3-R0 is designed to optimize the performance of high-power devices, such as CPUs, GPUs, and FPGAs. It is an ideal choice for a variety of applications, including data centers, servers, embedded systems, and networking devices. The Heat Sink is also compatible with a wide range of heat spreaders, including thermal pads and liquid cooling solutions. The Thermal - Heat Sink is designed to work with a variety of air and liquid cooling solutions, allowing users to customize their cooling system to ensure maximum performance and efficiency.
The ATS-18C-14-C3-R0 Heat Sink is designed with structural integrity in mind. The aluminum base and fins are durable and strong, allowing them to handle high thermal loads. The heat-dissipating pattern is designed to ensure maximum heat dissipation and cooling efficiency, while the anodized aluminum body provides superior corrosion resistance. The Thermal - Heat Sink also features a unique design that allows it to be easily mounted on a variety of devices and surfaces.
The ATS-18C-14-C3-R0 Thermal - Heat Sink is designed with reliable performance and optimal efficiency in mind. It is a highly efficient Thermal - Heat Sink, providing users with maximum cooling performance and durability. By utilizing an optimized heat-dissipating pattern, high-performance aluminum body, and anodized aluminum fins, the ATS-18C-14-C3-R0 Thermal - Heat Sink is designed to provide maximum efficiency and performance for a variety of high-powered devices. With its high-quality construction, reliable performance, and optimal efficiency, the ATS-18C-14-C3-R0 Thermal - Heat Sink is an ideal choice for any device or application requiring efficient thermal management and cooling.
The specific data is subject to PDF, and the above content is for reference