| Allicdata Part #: | ATS30106-ND |
| Manufacturer Part#: |
ATS-18C-43-C2-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18C-43-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.13740 |
| 10 +: | $ 3.05550 |
| 25 +: | $ 2.97259 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.85°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential part of any electronic system, especially when dealing with high heat conditions. Heat sinks are one of the most common methods used for cooling these systems. The ATS-18C-43-C2-R0 is a high-performance thermal heat sink that is used for cooling electronics in a variety of applications. This article will discuss the application field and working principle of the ATS-18C-43-C2-R0 heat sink.
The ATS-18C-43-C2-R0 is a type of heat sink that is designed for use in application fields such as power electronics, telecom, medical, consumer, and military. Its innovative design combines advanced technology and superior thermal performance to provide superior cooling capabilities. The heat sink is constructed using anodized aluminum that is coated with an electro-plated copper thermal conductor. The aluminum provides a good heat conduction along with a high thermal conductivity rating. The electro-plated copper thermal conductor provides improved transfer of heat away from the components and increases the performance of the heat sink.
The ATS-18C-43-C2-R0 heat sink is designed with an air-flow pattern that provides airflow directly onto the components that are mounted on the heat sink. This helps minimize the time required for the components to reach their operating temperatures and reduces the risk of overheating. In addition, the design of the heat sink ensures that the components will remain cool during operation and will not suffer from thermal stress.
The working principle of the ATS-18C-43-C2-R0 heat sink is based on the principle of convection. When the heat sink is exposed to a heat source, the heat is transferred to the air inside the heat sink. This heated air then rises and is pushed out of the heat sink, taking with it the heat from the electronic components that it was attached to. This helps to reduce the overall temperature of the system and helps to keep it within the acceptable operating temperature range for the components.
The ATS-18C-43-C2-R0 heat sink is a high-performance solution for electronics cooling in a variety of applications. Its unique design and innovative technology provide superior cooling capabilities and help protect the components from thermal stress. This heat sink is designed to meet the demands of various application fields and provides reliable and efficient cooling for all kinds of electronic systems.
The specific data is subject to PDF, and the above content is for reference