| Allicdata Part #: | ATS-18H-24-C3-R0-ND |
| Manufacturer Part#: |
ATS-18H-24-C3-R0 |
| Price: | $ 5.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18H-24-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.85793 |
| 30 +: | $ 4.58808 |
| 50 +: | $ 4.31827 |
| 100 +: | $ 4.04838 |
| 250 +: | $ 3.77849 |
| 500 +: | $ 3.50860 |
| 1000 +: | $ 3.44112 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.43°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important component for any type of electronic device. Without effective cooling, technological components can overheat, leading to failure or reduced output. Heat sinks are an active method of thermal management, using a combination of fin structures and cooled air to help dissipate heat from an electronic system. ATS-18H-24-C3-R0 is specifically designed for heat sink applications, and integrates a variety of technologies to ensure optimum performance.
ATS-18H-24-C3-R0 Heat Sink Construction
The ATS-18H-24-C3-R0 heat sink is composed of a finned aluminum construction, which is designed to increase the surface area of the heat sink while maintaining a reduced overall sizeand weight. The fins also facilitate greater convection and allow for the easy transfer of heat from the device to the atmosphere. ATS-18H-24-C3-R0 has an adjustable mounting system, allowing it to be attached directly to the device\'s chassis\' or other mounting systems. The heat sink can also be mounted using thermal interface material or barbs for increased mounting flexibility.
ATS-18H-24-C3-R0 Heat Sink Technologies
The ATS-18H-24-C3-R0 heat sink uses several innovative technologies designed to maximize thermal transfer. The heat sink is composed of a high-strength micro-fin structure that maximizes the contact area between the heat sink and the device being cooled, allowing for greater heat transfer. Additionally, the design of the heat sink includes exhaust holes that improve ventilation of the air surrounding the device and allow for maximum air flow. Finally, the heat sink has integral calorimeter technology which increases the heat sink\'s effectiveness by accurately measuring the thermal performance of the device and its environment.
ATS-18H-24-C3-R0 Application Fields and Working Principle
The ATS-18H-24-C3-R0 heat sink is a great choice for applications where space is a concern. The heat sink\'s small form factor and low weight make it ideal for locations where size and weight are a factor. Additionally, the adjustable mounting capabilities ensure that it can be integrated into a variety of different environments. The heat sink is also suitable for applications where high thermal conductivity is preferred, as the finned construction and calorimeter technology ensure maximum heat transfer. Finally, the heat sink is a great choice for applications where low noise is a priority, as the exhaust holes and finned design reduce the noise emissions from the device.
In operation, the ATS-18H-24-C3-R0 heat sink works by dissipating heat from the device being cooled to the atmosphere. The fins help to increase the effective surface area of the heat sink and provide additional convectional cooling, while the calorimeter measures the thermal performance of the device and its environment. The exhaust holes also aid in the heat dissipation process, as they allow for increased air flow around the device, which helps to more effectively transfer the heat away from the device. As a result, the ATS-18H-24-C3-R0 heat sink is an effective and reliable solution for any application where thermal management is essential.
The specific data is subject to PDF, and the above content is for reference