| Allicdata Part #: | ATS-19D-205-C3-R0-ND |
| Manufacturer Part#: |
ATS-19D-205-C3-R0 |
| Price: | $ 4.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-19D-205-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.03704 |
| 30 +: | $ 3.81255 |
| 50 +: | $ 3.58823 |
| 100 +: | $ 3.36401 |
| 250 +: | $ 3.13974 |
| 500 +: | $ 2.91548 |
| 1000 +: | $ 2.85942 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.09°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components in many types of commercial and industrial-grade electronic systems and the type and configuration of heatsinks can vary widely for each application scenario. One example of a system with a unique heat sink configuration is the ATS-19D-205-C3-R0. This product offers a variety of specified features and optimized cooling in certain situations.
The ATS-19D-205-C3-R0 is a thermally advanced extruded fin heat sink with a unique narrow profile design featuring multiple extruded fins optimized for higher thermal performance. This product features a diamond pattern that is carefully spaced to maximize airflow while minimizing influence on the thermal resistance from the air. The unique shape also allows for the product to be easily inserted into tight spaces.
The fin arrangement is made from aluminum and is designed to ensure superior metal contact with the heat source, allowing heat to spread rapidly while remaining extremely compact for space-constrained applications. The diamond pattern helps evenly transfer heat, allowing more effective cooling. Also, the external aluminum fins facilitate heat dissipation by allowing air to freely pass through.
When it comes to overall performance, the ATS-19D-205-C3-R0 delivers excellent thermally efficient performance, all while maintaining a low profile overall. The design also provides superior mechanical performance, with sturdy, robust construction that can withstand aggressive environments. This heat sink can handle operating temperatures up to 140° F, making it suitable for a wide variety of applications.
Given its modern design and the thermally efficient performance it delivers, the ATS-19D-205-C3-R0 is a great choice for any high-performance application where thermal management is of utmost importance. This product is especially well-suited to dispersed power systems, server applications, and high-powered LED arrays. In any of these uses, the product can help keep electronic systems stable and efficient for extended periods of time.
Thermal management is a key factor in keeping many electronic systems running smoothly for extended periods. It is important to find a quality heat sink that offers superior performance, and the ATS-19D-205-C3-R0 offers that and more. With its unique narrow profile design and multiple extruded fins, this product provides exceptional thermal performance and mechanical retention while also allowing maximum air flow.
The specific data is subject to PDF, and the above content is for reference
ATS-19D-205-C3-R0 Datasheet/PDF