ATS-19D-57-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.13°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-19D-57-C1-R0 Thermal – Heat Sinks Application Field and Working Principle Thermal – Heat Sinks are employed in a broad range of electronic applications, from servers and storage systems to telecommunications and automotive applications. Their use dramatically increases the effectiveness of cooling systems, often becoming the key component in ensuring device temperatures are kept in check. ATS-19D-57-C1-R0 Thermal – Heat Sinks are an example of a highly efficient thermal management solution.The ATS-19D-57-C1-R0 thermal – heat sink works on the principle of dissipating heat away from the source and into the surrounding environment. This is achieved through the use of a metal structure that consists of a finned base and fins. Heated air from the source component enters the heat sink and is drawn in by the fins. The heat is then spread across the fins and is eventually absorbed by the surrounding air, allowing the component to stay at a lower temperature.In general, ATS-19D-57-C1-R0 Thermal – Heat Sinks are designed for higher wattage components, such as CPUs and GPUs, that generate a lot of heat. Heat dissipation is increased by using the fins to spread out the heat more evenly. The fins also increase the amount of surface area available for the heat to be absorbed by the air. To increase the efficiency of the heat sink even further, a fan can be added to draw the hot air away from the component and out of the system.The ATS-19D-57-C1-R0 Thermal – Heat Sink is also designed to be used in a variety of different environments. It can be used in desktop PC, server, and workstation applications, as well as in more extreme environments such as automotive and military applications. This makes the heat sink highly versatile and able to handle high-power applications without compromising on performance.The ATS-19D-57-C1-R0 Thermal – Heat Sink can also be used as a passive cooling solution. In this mode, the heat sink does not require a fan and instead relies on convection to dissipate the heat away from the component. This makes the heat sink suitable for applications where noise levels are a concern, as there is no fan noise to worry about.Overall, the ATS-19D-57-C1-R0 Thermal – Heat Sink is an excellent choice for any electronic cooling application. Its large fin area and efficient heat dissipation make it suitable for applications ranging from desktop PCs to servers and industrial applications. The heat sink is also extremely versatile, allowing it to be used in a variety of different environments. Its compatibility with both active and passive cooling solutions further increases its versatility and makes it a great choice for any application.

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