ATS-19E-146-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-19E-146-C1-R0-ND

Manufacturer Part#:

ATS-19E-146-C1-R0

Price: $ 3.70
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X35MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19E-146-C1-R0 datasheetATS-19E-146-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.36420
30 +: $ 3.27348
50 +: $ 3.09154
100 +: $ 2.90972
250 +: $ 2.72785
500 +: $ 2.63691
1000 +: $ 2.36412
Stock 1000Can Ship Immediately
$ 3.7
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.98°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has been an important part of electronics since the original components were introduced. Heat is created through the use of the components, and adequate cooling must be provided to maintain their performance and reduce product failure. Heat sinks are one of the more common ways of providing effective cooling for electronics, providing efficient thermal transfer from the components to the environment.

The ATS-19E-146-C1-R0 is an advanced extruded aluminum heat sink specifically designed for superior thermal transfer in tight spaces. It has a combination of excellent convection and heat dissipation, with low air flow losses and improved cooling efficiency.

This particular heat sink has extensive application fields, including industrial computers, computers set-top boxes, routers, modems, audio/video amplifiers, digital signage, and integrated circuits (IC) packages. It is also designed to meet the needs of high-performance applications such as digital audio, digital video, PC/Server Computers, medical electronics, and telecom applications.

Using the ATS-19E-146-C1-R0 heat sink is simple and effective, no matter what the application. It is designed with a special profile shape to maximize performance, and includes support points for fast and easy installation. The mounting screws are also designed to ensure a secure fit and prevent slipping.

The working principle of the ATS-19E-146-C1-R0 heat sink is based on two main principles; convection and radiation. Convection cooling takes place through the use of air flow over the heat sink’s cooling fins. The air flow created by the fan will draw the heat away from the surface and dissipate it, thus reducing the total temperature of the system. Radiation cooling takes place when the heat is dissipated directly from the fins into the environment.

The ATS-19E-146-C1-R0 heat sink is designed to provide superior cooling performance in a variety of applications, ranging from small electronics to high-powered equipment. The combination of effective convection and radiation makes it a highly effective way to dissipate heat from any device or component. It is also easy to install, and can be used in tight spaces where other heat sinks may not fit.

The specific data is subject to PDF, and the above content is for reference

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