ATS-20C-09-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.56°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-20C-09-C1-R0 Application Field and Working Principle

Thermal-Heat Sinks have become an essential component in a large array of technological advances. They are used in a range of applications, from laptop computers to aircraft, and are designed to absorb and dissipate heat. Thermal-Heat Sinks utilize conduction, convection, and radiation heat transfer methods to help keep electronic components from overheating. This article will provide an overview of the ATS-20C-09-C1-R0, its application field, and its working principle.The ATS-20C-09-C1-R0 is a type of thermal-heat sink that utilizes a fin array transfer system. This type of sink is commonly used in electronic devices and machines that generate high levels of heat. The fins of this sink utilize a combination of passive and active mechanisms to efficiently transfer heat from an electronic component or device to the ambient environment, where it is dissipated. The passive method uses the fin array\'s large surface area to absorb heat, while the active system utilizes forced-air convection cooling.The ATS-20C-09-C1-R0 is primarily used in electronics devices that require a high level of cooling, such as CPUs, GPUs, and FPGAs. It is designed to absorb and dissipate the heat generated by the electronic components, while at the same time reducing the overall temperature of the device. The ATS-20C-09-C1-R0 also features an efficient air flow design, which helps to evenly cool the device. In addition, the fins of this sink are made of specialized materials that are generally very heat resistant.The ATS-20C-09-C1-R0 utilizes a two-stage conduction and convection system to efficiently dissipate heat. In the first stage, heat is transferred from the component to the array of fins, and then to the ambient environment. This process is accelerated by the active forced-air convection mechanism. In the second stage, the ambient air is circulated around the fins to further dissipate the heat.The ATS-20C-09-C1-R0 is designed to meet a variety of needs, ranging from general electronics cooling, to mission-critical cooling. It is ideal for applications such as servers, routers, embedded systems, and more. Thermal-Heat Sinks also have a wide range of benefits. They help to reduce the overall temperature of an electronics device, reducing the risk of overheating and helping to insure long-term reliability. In addition, they are generally more efficient at dissipating heat than other cooling methods, such as air cooling and heat pipes.In summary, the ATS-20C-09-C1-R0 is a thermal-heat sink that utilizes a fin array transfer system for improved cooling performance. Its combination of passive and active cooling techniques provides highly efficient heat transfer to the ambient environment. The sink is designed to meet a variety of needs, and is commonly used in electronics devices that generate high levels of heat. It offers many benefits in terms of overall performance and reliability, making it a popular choice in many applications.

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