| Allicdata Part #: | ATS-20F-138-C3-R0-ND |
| Manufacturer Part#: |
ATS-20F-138-C3-R0 |
| Price: | $ 3.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20F-138-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.97234 |
| 30 +: | $ 2.89170 |
| 50 +: | $ 2.73105 |
| 100 +: | $ 2.57040 |
| 250 +: | $ 2.40975 |
| 500 +: | $ 2.32942 |
| 1000 +: | $ 2.08845 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are mechanical devices used to manage heat by dissipating it and increasing its area for convection. Heat sinks are typically designed to reject heat from a higher temperature component to a lower temperature outside environment, usually air or other liquid cooling systems. There are different types of material used to make heat sinks, including aluminum, copper, and ceramic. One of the most widely used types of heat sinks is the ATS-20F-138-C3-R0.
What Is The ATS-20F-138-C3-R0?
The ATS-20F-138-C3-R0 is a medium-sized, aluminum, extruded heat sink with a free air flow rate of 3.5 cfm and a thermal resistance of 0.76˚C/W. The ATS-20F-138-C3-R0 has an overall size of 35.6″ x 3.9″ x 1.2″ and has up to 138 fins. The fins are engineered to provide maximum air flow and heat dissipation. Each fin is made of aluminum with a custom designed micro-fin structure that provides enhanced heat transfer.
ATS-20F-138-C3-R0 Application Fields And Working Principle
The ATS-20F-138-C3-R0 is a versatile heat sink that can be used in a variety of applications. It is typically used in consumer electronics, LED lighting, industrial applications, and automotive applications. The ATS-20F-138-C3-R0 heat sink is designed to dissipate heat from a variety of electronics and components, including CPUs, DSPs, GPUs, and memory chips. The heat is dissipated through the fins, which increases the surface area of the heat sink and allows for greater convection of outside air.
The ATS-20F-138-C3-R0 heat sink works by transferring heat away from the electronic components it is attached to. Heat sinks are typically attached to the components by thermal interface material, such as thermal paste, which allows for enhanced heat transfer from the component to the heat sink. The heat is then transferred from the heat sink to the surrounding air by convection. The aluminum fins on the heat sink increase the surface area for increased air convection, thus allowing the heat sink to dissipate more heat from the component.
Conclusion
The ATS-20F-138-C3-R0 heat sink is a versatile and effective solution for managing heat from a variety of electronic components and devices. Its aluminum fins provide a large surface area and high free air flow rate, helping to effectively dissipate heat away from electronic components. Heat sinks are an important component for ensuring the stable operation of electronic components, and the ATS-20F-138-C3-R0 is a great choice for any application.
The specific data is subject to PDF, and the above content is for reference