ATS-21C-127-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-21C-127-C3-R0-ND

Manufacturer Part#:

ATS-21C-127-C3-R0

Price: $ 4.23
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X20MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21C-127-C3-R0 datasheetATS-21C-127-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.80520
30 +: $ 3.59415
50 +: $ 3.38260
100 +: $ 3.17123
250 +: $ 2.95982
500 +: $ 2.74840
1000 +: $ 2.69555
Stock 1000Can Ship Immediately
$ 4.23
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.91°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical component of many electronic systems. In recent years, the increasing demand for higher level of electronic system performance has driven the development of robust thermal solutions such as the ATS-21C-127-C3-R0 heat sink. This device is a reliable thermal management solution designed for a variety of industrial, medical, aerospace, defense and telecoms applications.

The key to the effectiveness of the ATS-21C-127-C3-R0 heat sink lies in its design. The device is constructed from a combination of bonded aluminum/copper fins and passive copper tubing. This design provides high surface area for efficient thermal dissipation. The device also features a broad range of fanless thermal control options that allow it to be used in a variety of temperature ranges and environments. The thermal interface material used in the device is also in compliance with a wide range of standards.

The ATS-21C-127-C3-R0 heat sink is a high-performance thermal control solution due to its efficient heat transfer characteristics. The device features a unique dual-heat transfer design that utilizes a combination of convection and conduction. The convection design involves the air-cooled finned structure that helps to dissipate the heat away from the device. The conduction design provides superior heat transfer from the device to the heat-sink itself by utilizing passive copper tubing.

The ATS-21C-127-C3-R0 heat sink is also designed for ease of installation. The aluminium/copper construction ensures that installation is fast and easy, and the passive copper tubing provides for a seamless transition between the device and the heat dissipation system. Moreover, the device is designed to meet a broad range of heat-sink requirements in terms of size, mounting options and form.

In addition to its efficient thermal control capabilities, the ATS-21C-127-C3-R0 heat sink also offers superior performance in terms of noise control. The device has been designed to minimize the audible noise output of the heat-sink by employing a high-quality fan and an effective vibration damping system. The combined efforts of these components results in a significant reduction in audible noise levels.

In conclusion, the ATS-21C-127-C3-R0 heat sink is an effective thermal management solution that is ideal for a variety of industrial, medical, aerospace, defense and telecoms applications. The device is designed for high thermal transfer efficiency, robust performance, and easy installation. Furthermore, its superior noise control capabilities ensure that the device can be used in a wide range of environments without fear of generating excess noise levels. As such, the ATS-21C-127-C3-R0 heat sink is an ideal solution for anyone looking for reliable thermal control solutions.

The specific data is subject to PDF, and the above content is for reference

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