ATS-21C-139-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.37°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

Thermal Heat Sinks are commonly used in electronic and other industries, for cooling and preventing overheating of various components and circuits. In Electronics, Thermal Heat Sinks are devices that help facilitate heat dissipation by generating a larger surface area on which heat can be stored. This allows a component to remain at a desirable temperature, and eliminates the risk of it getting too hot.The ATS-21C-139-C3-R0 is one such Thermal Heat Sink, which is a compact, cost effective and easy to install solution for thermal heat dissipation. It is designed to keep temperature-sensitive components cool and safe, and features a specially designed, highly efficient heatsink base. This Thermal Heat Sink is highly efficient and boasts of outstanding thermal performance, ensuring that even in the most demanding of applications this device can keep components operating at optimal levels.

Functionality

The primary function of the ATS-21C-139-C3-R0 is to dissipate heat via thermal conduction. It works by engaging with a component, dissipating its heat away quickly, and preventing it from reaching dangerous temperatures. This is done by the Thermal Heat Sink\'s unique design, which extends out from the component, allowing for greater surface area to dissipate heat. The thermal conduction mechanism of the ATS-21C-139-C3-R0 is also enhanced by the utilised of a heat sink material (usually copper) that has an increased thermal transfer rate due to its thermal conductivity.

Design and Performance

The ATS-21C-139-C3-R0 has an innovative design that combines an optimized profile with enhanced thermal performance. It\'s design includes a patented fluted base and ridged side-fins with a large surface area for improved heat dissipation across a wide temperature range. It also includes a mounting system, which allows the product to be quickly and easily installed to the component without the need for adhesives.The performance of the ATS-21C-139-C3-R0 is off the charts, and it is capable of dissipating a wide range of heat levels, from high to very low. Moreover, its efficient design has a low profile, and it is compatible with a variety of platforms, both in and out of the box. This means that the ATS-21C-139-C3-R0 can be used in practically any environment, as it has been designed to withstand a wide range of temperatures, vibrations, and pressures.

Application Fields

The ATS-21C-139-C3-R0 can be used in a variety of applications, such as electronic and industrial applications including cooling CPUs, fan motors, and PCBs. It can also be used in audio/video equipment, LED lighting, power converters, and servers. Furthermore, It is highly suitable for integrating into a customer’s existing system due to its compatibility with a wide range of components.In addition to electronics and industrial applications, the ATS-21C-139-C3-R0 can also be used in automotive and HVAC applications. It can provide additional cooling to cars and trucks, as well as providing efficient cooling to air conditioners and refrigerators. It is also suitable for use in medical applications, such as cooling MRI scanners.

Conclusion

The ATS-21C-139-C3-R0 Thermal Heat Sink is a cost-effective and easy to install solution for dissipating heat away from electronic components and circuits. This Thermal Heat Sink has an innovative design, which combines an optimized profile with enhanced thermal performance. It is also highly efficient, with a very low profile that ensures that it is compatible with a wide range of platforms. The ATS-21C-139-C3-R0 can be used in various fields, including electronic and industrial applications, automotive/HVAC applications, and medical applications. All in all, the ATS-21C-139-C3-R0 is an excellent choice for safely and effectively dissipating heat away from sensitive components.

The specific data is subject to PDF, and the above content is for reference