| Allicdata Part #: | ATS-21C-77-C1-R0-ND |
| Manufacturer Part#: |
ATS-21C-77-C1-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21C-77-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor when it comes to the performance and reliability of electronic devices. With the advancements in technology, modern electronic devices have the ability to perform faster and do more. However, for these devices to perform as expected, proper heat dissipation must be maintained through the use of heat sinks or other thermal management solutions. One of the most popular solutions is the ATS-21C-77-C1-R0 Thermal-Heat Sink.
The ATS-21C-77-C1-R0 Thermal-Heat Sink is designed for applications that require cooling performance to avoid system over-temperature, reduce the circuit board temperature to an acceptable level, and ensure the reliability of the electronic components. This thermal management solution consists of a thermal pad and an aluminum fin design. The thermal pad contains a specially formulated pressure-sensitive adhesive that keeps the heat sink securely attached to the device, while the aluminum fin design effectively removes heat from the device and dissipates it into the surrounding environment.
The ATS-21C-77-C1-R0 Thermal-Heat Sink can be used in a variety of applications such as low-power CPUs, Small Form Factor (SFF) CPUs, and other high-performance components. It is designed to provide maximum cooling performance and reliability in a compact design. The aluminum fin design also reduces air resistance to help minimize acoustic noise generation. The ATS-21C-77-C1-R0 Thermal-Heat Sink features a high-performance fan that can be used to increase airflow and cooling performance. The fan also features variable speed settings to optimize airflow and cooling performance.
In terms of its working principle, the ATS-21C-77-C1-R0 Thermal-Heat Sink works by utilizing a series of metal heat dissipaters. These dissipaters have both the ability to absorb and transfer the heat, without any need for additional cooling components. The heat is then transferred to the metal fins which then conduct the heat away from the device. The extra heat is then dissipated into the surrounding environment. The fan also helps to increase the efficiency of the heat removal process by providing extra airflow, allowing the device to remain cool and operate properly.
Overall, the ATS-21C-77-C1-R0 Thermal-Heat Sink is an effective thermal management solution for a variety of applications. Its aluminum fin design ensures maximum cooling performance and reliability. It also features a high-performance fan that helps to increase the efficiency of heat removal and reduce acoustical noise. The ATS-21C-77-C1-R0 Thermal-Heat Sink is an ideal solution for the electronic cooling requirements of any electronic system.
The specific data is subject to PDF, and the above content is for reference