ATS-21D-01-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS34915-ND

Manufacturer Part#:

ATS-21D-01-C2-R0

Price: $ 3.64
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21D-01-C2-R0 datasheetATS-21D-01-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.30750
10 +: $ 3.22182
25 +: $ 3.13463
50 +: $ 2.96050
100 +: $ 2.78630
250 +: $ 2.61218
500 +: $ 2.52510
1000 +: $ 2.26388
Stock 1000Can Ship Immediately
$ 3.64
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 21.93°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management of electronic components is an essential consideration for maintaining optimal performance, longevity, and greater efficiency. Heat sinks are often the first line of defense against high temperatures, allowing manufacturers to maintain the specialized environments in which these components can best operate, giving them the best opportunity to reach their full potential. The ATS-21D-01-C2-R0 is a versatile heat sink with a wide range of potential applications to dissipate unwanted heat.

The ATS-21D-01-C2-R0 is primarily constructed from aluminum and features an 11mm thick single fin design. It’s dimensions are 159mm x 79mm and the heat sink has a maximum height of 30mm, making it a large, bulky heat sink that is ideal for attaching to large components that may generate heat, such as circuit boards, power supplies, and electronic amplifiers.

In addition to its large size, the ATS-21D-01-C2-R0 provides a quality thermal interface between the heat source and the device itself. The aluminum material works by dissipating heat energy from the device into the surrounding atmosphere through an extended cooling area, thereby reducing the internal temperature of the device. This thermal transfer is further enhanced by the inclusion of integrated heat pipes, which allow for a higher level of cooling efficiency.

The ATS-21D-01-C2-R0 offers excellent thermal resistance, with a thermal resistance of 0.112°/W. This level of thermal resistance provides superior cooling performance and leads to more consistent, reliable levels of performance. In addition, the fin design allows the heat sink to easily fit into confined aerial spaces and can be installed in areas that cannot easily accommodate larger heat sink designs. Furthermore, the side-plates, which are attached to the fin, offer additional cooling performance.

The ATS-21D-01-C2-R0 provides various heat sink mounting options, allowing manufacturers to choose the solution that is best suited to their application. In order to efficiently attach the heat sink to the desired device, manufacturers can achieve greater compliance with holes on the base for mounting screws, as well as an adhesive mounting surface for simple installation. Additionally, the insert design allows for a neat, more aesthetically pleasing solution to attaching the heat sink.

Overall, the ATS-21D-01-C2-R0 is a versatile and effective heat sink solution that offers excellent thermal performance, easy installation, and effective cooling in a cost-effective solution. With its wide range of applications, manufacturers can rely on the ATS-21D-01-C2-R0 to greatly improve the cooling performance of their components and ensure maximum performance and longevity.

The specific data is subject to PDF, and the above content is for reference

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