| Allicdata Part #: | ATS-21H-36-C3-R0-ND |
| Manufacturer Part#: |
ATS-21H-36-C3-R0 |
| Price: | $ 5.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21H-36-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.11245 |
| 30 +: | $ 4.82853 |
| 50 +: | $ 4.54444 |
| 100 +: | $ 4.26044 |
| 250 +: | $ 3.97641 |
| 500 +: | $ 3.69238 |
| 1000 +: | $ 3.62137 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-21H-36-C3-R0 is an advanced thermal solution designed to dissipate heat from today\'s most powerful electronics components. It is a good choice for anyone looking for an efficient way to reduce the temperature of their electronics components, whether it be in a laptop, video card, or other electronic device.
Although the ATS-21H-36-C3-R0 is designed to dissipate heat from electronics components, it is also used in the field of thermal management. The main purpose of the ATS-21H-36-C3-R0 is to transfer heat away from the heat source, usually the processor or other elements in an electronic device. This is done so that the device or components inside can operate at a cooler temperature and therefore last longer, maintain peak performance, or reduce power consumption.
Heat is transferred away from the device by using a combination of radiative and convective heat transfer. A heat sink is attached to the back of the processor or other components, which works by absorbing the heat generated by the device. The heat is then transferred away from the heat source through the air or within a liquid medium.
The heat sink will have multiple fins on its surface, which increases the surface area available to dissipate heat. As air or other liquid medium passes through these fins, more heat is dissipated from the processor or other components. This process also helps to keep the processor or component at an even temperature.
To maximize performance and effectiveness of the thermal solution, it is important to make sure that the heat sink is correctly sized and placed in the correct position. This is important to ensure that the device or component is receiving optimal cooling performance, and not underperforming because of an improperly sized or placed heat sink.
The ATS-21H-36-C3-R0 is a highly advanced thermal solution that has been designed to ensure that electronics components receive optimal cooling and are kept at a consistent temperature for optimum performance and efficiency. By using the correct sized and placed heat sink, users can make sure that their device or component is running at its peak potential.
The specific data is subject to PDF, and the above content is for reference