| Allicdata Part #: | ATS-53425W-C2-R0-ND |
| Manufacturer Part#: |
ATS-53425W-C2-R0 |
| Price: | $ 7.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 42.5X42.5X24.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53425W-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.78384 |
| 30 +: | $ 6.38486 |
| 50 +: | $ 5.98588 |
| 100 +: | $ 5.58678 |
| 250 +: | $ 5.18772 |
| 500 +: | $ 5.08794 |
| 1000 +: | $ 4.98818 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.673" (42.50mm) |
| Width: | 1.673" (42.49mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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ATS-53425W-C2-R0 is a type of thermal-heat sinks and is one of the most popular and widely used products in the electronic industry due to its wide range of applications and high performance. It is a heat sink composed of a combination of fin structures and a base, which use convection to transfer heat away from a particular area or component. The fin structures, which are usually made of metal or aluminum, are designed to create an open air gap between the area needing cooling and the surrounding atmosphere so that the heat can escape more easily. The base can be either a flat or a curved surface, which helps to increase the rate of heat transfer.
The working principle of ATS-53425W-C2-R0 is thermal conduction. This means that heat is conducted through the fin structure and base by being transferred through different materials. The material used in the fin structure is usually aluminum and the base is usually copper to increase the rate of heat transfer. The fin structure is usually attached directly to the area needing cooling, such as a processor or a circuit board, and the fin structures will draw the heat away from the component. This heat is then transferred to the base, which has a series of fins that are connected to a series of heat pipes. The heat pipes are connected to a heatsink, which dissipates the heat into the surrounding air. This enables the part or component to stay at a safe operating temperature.
The ATS-53425W-C2-R0 thermal-heat sink is a great choice for any application that requires effective thermal management and performance. It is especially ideal for high performance applications such as computer processors, video cards, and other electronics. It is also a great choice for applications where space is limited, as the fin structures are designed to fit in smaller spaces and still offer a high level of thermal management. The ATS-53425W-C2-R0 is a reliable and durable thermal-heat sink and is perfect for a wide range of applications.
In conclusion, the ATS-53425W-C2-R0 thermal-heat sink is a reliable, efficient, and durable type of thermal-heat sink. Its combination of fin structures and base is designed to efficiently transfer heat away from the component and into the surrounding air. It is a great choice for applications that require larger amounts of thermal performance and efficiency, and for those that are space constrained. Its numerous applications, high heat transfer rate, and easy installation makes it an ideal choice for any application.
The specific data is subject to PDF, and the above content is for reference