ATS-EXL312-300-R0

Series:	--
Part Status:	Active
Type:	Top Mount, Extrusion
Package Cooled:	--
Attachment Method:	Adhesive
Shape:	Rectangular, Fins
Length:	11.811" (300.00mm)
Width:	3.150" (80.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	0.40°C/W @ 800 LFM
Thermal Resistance @ Natural:	10.70°C/W
Material:	Aluminum
Material Finish:	Degreased

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ATS-EXL312-300-R0 Thermal - Heat Sinks Application Field and Working Principle

The ATS-EXL312-300-R0 thermal - heat sink is a specialized component used for transferring heat within electronic devices. By dissipating heat away from sensitive components – such as processors, graphics chips, and other semiconductors – it helps ensure that these components do not overheat and malfunction. It does this through a process known as heat dissipation, which uses a method of directed airflow to cool the components and the surrounding environment.The ATS-EXL312-300-R0 thermal - heat sink is designed to be used in a variety of applications. Most commonly, they are used in electronics such as computers, gaming consoles, smartphones, and other electronic devices where thermal management is important. This product can also be used to improve the efficiency of air conditioning systems, by dissipating heat from interior areas and helping to maintain a comfortable environment.The ATS-EXL312-300-R0 thermal - heat sink is a relatively simple device, but one that requires an understanding of thermal management principles in order to be used correctly. By understanding the principles behind thermal management and heat dissipation, users can confidently select the right heat sink for their application and ensure optimal performance.The ATS-EXL312-300-R0 thermal - heat sink works by transferring heat away from sensitive components through a process known as thermal conduction or heat transfer. When two different surfaces are in contact, heat will always transfer from the hotter surface to the cooler one. Heat sinks use this principle by providing a surface which is cooler than the components, so the heat is transferred away from the component and into the air.The ATS-EXL312-300-R0 thermal - heat sink is designed with a combination of features which help to maximize its thermal management capabilities. First, the body of the heat sink is made up of anodized aluminum, which is an excellent conductor of heat. This allows the heat generated by the components to spread more quickly across the surface of the heat sink.Second, the ATS-EXL312-300-R0 thermal – heat sink also features a series of fins which help to further increase its efficiency. These fins act as small heat radiators, dispersing heat away from the surface of the heat sink in order to reduce the overall operating temperature of the components.Finally, the ATS-EXL312-300-R0 thermal - heat sink also features a series of vents which allow air to pass through the device. This air acts as a cooling agent, helping to disperse the heat away from the components and into the atmosphere. The combination of these features helps to increase the efficiency of the device, thereby reducing the risk of component overheating.In conclusion, the ATS-EXL312-300-R0 thermal – heat sink is a device which can be used to effectively transfer heat away from sensitive components. By providing a surface which is cooler than the components, it helps ensure that the components do not become overheated. Combined with its finned surfaces and air vents, the ATS-EXL312-300-R0 thermal - heat sink is a reliable and effective thermal management solution.

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