| Allicdata Part #: | ATS36129-ND |
| Manufacturer Part#: |
ATS-FPX030030015-50-C3-R0 |
| Price: | $ 2.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB FP |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-FPX030030015-50-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 2.11050 |
| 10 +: | $ 2.05695 |
| 25 +: | $ 2.00113 |
| 50 +: | $ 1.88987 |
| 100 +: | $ 1.77874 |
| 250 +: | $ 1.66756 |
| 500 +: | $ 1.61197 |
| 1000 +: | $ 1.44521 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important for devices and equipment that generate a lot of heat. Heat sinks are designed to dissipate the thermal energy generated by electronic components. ATS-FPX030030015-50-C3-R0 is a type of heat sink specially designed for high heat-generating applications. In this article, we will discuss the application field and working principle of ATS-FPX030030015-50-C3-R0.
Application Field
The ATS-FPX030030015-50-C3-R0 heat sink is mainly used in three application fields, namely power module, power module backplane, and semiconductor devices.
- Power Module: The ATS-FPX030030015-50-C3-R0 heat sink is designed specifically for power modules. Power modules generate a lot of heat which needs to be dissipated in order to prevent them from overheating. The ATS-FPX030030015-50-C3-R0 features an optimized profile and fin structure to ensure effective heat transfer from the power module.
- Power Module Backplane: The ATS-FPX030030015-50-C3-R0 heat sink is also suitable for power module backplanes. The advanced design of the ATS-FPX030030015-50-C3-R0 ensures reliable heat dissipation and prevents equipment from overheating.
- Semiconductor Devices: The ATS-FPX030030015-50-C3-R0 heat sink is also suitable for cooling semiconductor devices. The advanced profile and fin structure of the ATS-FPX030030015-50-C3-R0 ensures effective heat transfer from the devices, thus preventing equipment from overheating.
Working Principle
The ATS-FPX030030015-50-C3-R0 uses a combination of passive air and thermoelectric cooling to dissipate thermal energy. The passive air cooling system utilizes the natural circulation of air to dissipate heat, while the thermoelectric cooling system utilizes the Peltier effect to absorb heat from the heat source. The combination of these two cooling systems ensures effective and efficient heat dissipation from the device or equipment.
Firstly, the ATS-FPX030030015-50-C3-R0 heat sink features an optimized profile and fin structure. This ensures that the maximum amount of air can pass through the fin structure to facilitate natural air circulation. The air circulates through the heat sink and dissipates the thermal energy generated by the device or equipment.
Secondly, the ATS-FPX030030015-50-C3-R0 features a thermoelectric cooling system. This system utilizes the Peltier effect to absorb heat from the heat source. The thermoelectric system absorbs the heat from the heat source and dissipates it through the heat sink. This ensures effective and efficient heat dissipation from the device or equipment.
In conclusion, the ATS-FPX030030015-50-C3-R0 heat sink is a specialized heat sink designed for high heat-generating applications. It uses a combination of passive air cooling and thermoelectric cooling to dissipate thermal energy. The advanced fin structure and thermoelectric cooling system ensure effective and efficient heat dissipation from the device or equipment. The ATS-FPX030030015-50-C3-R0 heat sink is mainly used in power modules, power module backplanes, and semiconductor devices.
The specific data is subject to PDF, and the above content is for reference