| Allicdata Part #: | ATS-P2-60-C3-R0-ND |
| Manufacturer Part#: |
ATS-P2-60-C3-R0 |
| Price: | $ 4.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-60-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.21029 |
| 30 +: | $ 3.97635 |
| 50 +: | $ 3.74245 |
| 100 +: | $ 3.50860 |
| 250 +: | $ 3.27469 |
| 500 +: | $ 3.04079 |
| 1000 +: | $ 2.98231 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential part of many industries. It is especially critical in electronics and other high-powered machines and appliances. The ATS-P2-60-C3-R0 is a heat sink designed to provide adequate thermal management for equipment that requires it. Here we discuss the application field and working principle of the ATS-P2-60-C3-R0.
The ATS-P2-60-C3-R0 is specifically designed for machine and computer applications. It is typically used in combination with fan shrouds, air flow management panels and cooling systems. The heat sink provides cooling capacity for CPU and other micro-electronic components and helps keep device components from overheating during prolonged use. The heat sink is also designed to provide reliable heat diffusion and reduce thermal stress on the surrounding components.
The working principle of the ATS-P2-60-C3-R0 is based on the physics of thermodynamics. The heat sink uses thermal conduction to transfer heat generated by the components to the sink and disperse it throughout the device. By using a combination of convection and radiation, the heat is efficiently and quickly distributed around the device, cooling the components to the desired levels. The process of thermal conduction relies on efficient heat transfer to and from the device, and the ATS-P2-60-C3-R0 is designed to maximize this transfer and minimize potential heat overload.
The ATS-P2-60-C3-R0 is an effective and efficient heat sink specifically designed for modern machines and components. It is easy to install and requires minimal maintenance. The heat sink is made of durable materials that provide superior heat dissipation and requires no additional cooling systems for operation. This makes it an ideal heat sink for use in a range of applications including those with high heat requirements and those demanding additional cooling capacity.
The ATS-P2-60-C3-R0 has been designed to provide high-quality thermal management for a wide range of uses. Its efficient heat transfer capabilities make it an ideal choice for computer and machine applications. Its reliable performance, easy installation and low-maintenance requirements all contribute to its popularity in these industries. As such, it is an essential component of the modern thermal management industry.
The specific data is subject to PDF, and the above content is for reference