CXB3070-0000-000N0HBB35G

Current - Test:	1.9A
Lens Type:	Flat
Light Emitting Surface (LES):	23.00mm Diameter
Height:	1.70mm
Size / Dimension:	27.35mm L x 27.35mm W
Features:	--
Viewing Angle:	115°
CRI (Color Rendering Index):	80
Current - Max:	2.8A
Lumens/Watt @ Current - Test:	143 lm/W
Voltage - Forward (Vf) (Typ):	36V
Temperature - Test:	85°C
Series:	Xlamp® CXB3070
Flux @ Current/Temperature - Test:	9750 lm (9500 lm ~ 10000 lm)
Configuration:	Square
Wavelength:	--
CCT (K):	3500K 3-Step MacAdam Ellipse
Color:	White, Warm
Type:	Chip On Board (COB)
Moisture Sensitivity Level (MSL):	--
Part Status:	Active
Lead Free Status / RoHS Status:	--
Packaging:	Tray

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IntroductionThe CXB3070-0000-000N0HBB35G is a ceramic-based COB (Chip on Board) package that is specifically designed for integrated solid-state lighting applications including LED lighting. It is a high-tech, high-lumen and high-power LED package that offers superior performance and excellent optical properties for versatile applications in many industries.Application FieldThe CXB3070-0000-000N0HBB35G is primarily used in LED lighting applications. It is suitable for a wide range of lighting applications, including area lighting, linear lighting, road lighting, flood lighting, spot lighting, architectural lighting, horticultural lighting, decorative lighting, and retail/store lighting.The package is also used in a variety of other applications, including lighting for television and broadcasting, stage lighting, and automotive lighting. It is also suitable for use in various medical and industrial applications.Working PrincipleThe CXB3070-0000-000N0HBB35G is a ceramic-based COB (Chip on Board) package that works through a combination of electrical and optical means. Its components are mounted directly onto a ceramic substrate. This allows for efficient heat dissipation and high power levels, resulting in an LED package that is both efficient and powerful.The LED emits light when electrical current flows through it. The light is then directed, through the use of an optical lens or reflector, to achieve the desired lighting effect. The shape and size of the lens and reflector determines the amount of power and light output. The light emitted from the package is also affected by the wavelength, the amount of current, and the operating temperature of the package.ConclusionThe CXB3070-0000-000N0HBB35G is a ceramic-based COB (Chip on Board) package that is specifically designed for integrated solid-state lighting applications including LED lighting. It is suitable for a wide range of lighting applications and is also used in various other applications, such as lighting for television and broadcasting, and automotive lighting. The package works through a combination of electrical and optical means, with the light being directed and the power and light output being determined by the lens and reflector. Ultimately, the CXB3070-0000-000N0HBB35G helps to provide efficient, high-quality and versatile lighting.

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