DF9-23P-1V(20)

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DF9-23P-1V(20) rectangular connectors are specifically engineered to meet a wide range of interconnect requirements in the Arrays, Edge Type, Mezzanine (Board to Board) application field. These connectors offer a viable solution for the critical link between printed circuit boards. The connection is fast and reliable, thanks to their design featuring the double finger contact system having a high mating force and a high contact pressure which ensure accurate and secure mating. The rectangular shell of the versions offers optimal shielding effectiveness for both board-to-board and wire-to-board connection types.

DF9-23P-1V(20) connectors are produced with a high-temperature thermoplastic housing with self-lubricated metal pins and press-fit termination for wire-to-board assembly. The insulation-displacement contact (IDC) technology used in these connectors enables rapid, dependable assembly and reliable operation on the end product. Furthermore, these connectors are designed to incorporate solder connections which hold structure and maintain connection integrity even in the most rugged environments.

The DF9-23P-1V(20) connector is based on MI technology, which is flexible, modular and expandable. Its simple layout and features allow for fast and easy assembly, even for the most complex wiring schemes. The design of its connectors helps to reduce weight, size, insertion and mating force, and it also offers the highest levels of quality, reliability and cost savings. Additionally, the artificial intelligence technology that is incorporated into these connectors can adjust and configure the pins in the connectors for maximum performance, making them an ideal choice for applications where performance and reliability are critical.

The DF9-23P-1V(20) connector has a contact system that provides a secure and robust mechanical and electrical connection. It can be customized owing to its modular structure to allow for a range of pin, wire and mounting options. This feature makes it an excellent choice for applications requiring a mean time before failure (MTBF) of more than 300,000 cycles. Furthermore, the board-to-board and wire-to-board connection options provide a reliable and secure connection for the most precise applications. Additionally, these connectors ensure low energy loss, easy installation, and high operational safety in the most challenging environments.

In Arrays, Edge Type, Mezzanine (Board to Board) application field, DF9-23P-1V(20) connectors allow for the most effective utilization of space and time, making them a cost-effective choice for such applications. These connectors offer significant benefits such as low insertion force, low contact resistance, and a high level of contact system reliability. The plugs and sockets have the same arrangement and can be used as straight or angled plugs, depending on the application. In addition, these connectors are also designed to withstand the toughest of vibrations and shock.

The DF9-23P-1V(20) connectors’ performance is based on their design structure and operating flexibility. They have a robust construction for increased durability in challenging environments. The design ensures reliable contact capability and steady electrical performance, even in the most critical applications. Additionally, because of their attractive appearance and light weight, the DF9-23P-1V(20) connectors are easy to install and maintain. Plated parts have the highest solderability and the connector is designed to be compatible with all common soldering systems.

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