DPAF-15-03.0-S-8-1-A-K

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The DPAF-15-03.0-S-8-1-A-K is a type of array, edge type, mezzanine (board to board) connector that is commonly used in many industries, including automotive, medical, telecommunication, industrial automation and military/aerospace. It is designed to provide a dependable and secure electrical connection between two printed circuit boards for a wide variety of applications.

The DPAF-15-03.0-S-8-1-A-K is a multi-row, mezzanine style connector that combines excellent electrical performance with comprehensive, secure retention characteristics. It features a two part mixed pitch design that allows for a flexible connection between the two boards. The interface of the connector is designed to minimize crosstalk and radio frequency interference (RFI). It has a dielectric withstanding voltage (DWV) of 1,000 volts, an insertion loss of less than 1 dB, and an isolation resistance of greater than 10 G ohms. The contact interface of the connector features a retention force of between 20 and 40N, which ensures that the connection between the two boards is consistently secure during operation.

The DPAF-15-03.0-S-8-1-A-K is a RoHS compliant product that is rated for an operating temperature of -40°C to 125°C. It has a contact material of phosphor bronze with 2 µm gold over copper nickel finish, and a receptacle lead-frame material of phosphor bronze with a tin plating. The contact current carrying capacity of the connectors is rated at up to 1.5A. It is an 8mm X 13mm package designed for through-hole circuit board assembly.

The DPAF-15-03.0-S-8-1-A-K is suitable for applications in which a secure, reliable electrical connection between two printed circuit boards is required. The connector innovations of this particular model, including its small form factor, mixed pitch design, secure retention characteristics, and high electrical performance, make it an excellent choice for a variety of applications. It can be used in military and aerospace applications that require a dependable connection between multiple boards, or in automotive applications that require a secure connection to multiple sensors in a single location. It can also be used in a wide range of industrial and medical applications that call for reliable connectivity between two boards in a confined space.

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