IL-312-70P-VF30-A1 Allicdata Electronics
Allicdata Part #:

IL-312-70P-VF30-A1-ND

Manufacturer Part#:

IL-312-70P-VF30-A1

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: JAE Electronics
Short Description: CONN HEADER 70POS 0.5MM SMD
More Detail: 70 Position Connector Plug, Center Strip Contacts ...
DataSheet: IL-312-70P-VF30-A1 datasheetIL-312-70P-VF30-A1 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: IL-312
Packaging: Tray 
Part Status: Obsolete
Connector Type: Plug, Center Strip Contacts
Number of Positions: 70
Pitch: 0.020" (0.50mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: Solder Retention
Contact Finish: Gold
Contact Finish Thickness: 3.90µin (0.099µm)
Mated Stacking Heights: 3mm, 3.5mm
Height Above Board: 0.081" (2.05mm)
Description

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The IL-312-70P-VF30-A1 is an edge type mezzanine (board to board) rectangular connector array. It is a 2x3 array of individual 0.2 inch pitch female receptacles that accept 3.00mm pin width box headers. This connector array is designed to securely connect two boards together in an embedded system environment for either power, data, or signal applications.

The IL-312-70P-VF30-A1 is rated for a maximum current of 2A, a maximum voltage of 12V, and an operating temperature range of -40°C to 85°C. It also has gold plated nickel shell contacts for superior corrosion resistance and to ensure secure connections. The connector body is made from polysulfone plastic, a UL94V-0 rated material that is highly resistant to heat, chemicals, and mechanical stress.

The IL-312-70P-VF30-A1 is designed for a variety of applications, including automotive, communications, consumer electronics, and industrial applications. It is an ideal solution for connecting boards in embedded systems, where space is limited and a secure connection is required. The standard 2x3 array of female receptacles allows for multiple board connections at once, while the 0.2 inch pitch ensures compatible mating with box headers of the same size and pitch.

The working principle of the IL-312-70P-VF30-A1 is simple and straightforward. The two boards are aligned and mated such that the female receptacles of the connector array are facing the pins of the box header. Then, with the application of pressure, the female pins slide onto the male pins of the box header and secure the connection. The connector array also has a latching mechanism that ensures the connection will remain firmly in place.

In summary, the IL-312-70P-VF30-A1 is an edge type mezzanine (board to board) rectangular connector array that is designed to securely connect two boards together in an embedded system environment. It is rated for a maximum current of 2A, a maximum voltage of 12V, and an operating temperature range of -40°C to 85°C. It is suitable for a variety of automotive, communications, consumer electronics, and industrial applications. The working principle of the connector array is simple and straightforward, with a latching mechanism to ensure the connection remains firm and secure.

The specific data is subject to PDF, and the above content is for reference

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