IL-312-A60S-VFH05-A1

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The IL-312-A60S-VFH05-A1is a rectangular connector array, edge type and mezzanine (board-to-board) connector. It is an advanced self-mating, surface mount connector system that combines high speed signal integrity, modular design and strong reliability into a single connector technology. It is designed for multi-row, right-angled board-to-board, and mid-power applications. It is suitable for high-density mezzanine board applications, and features a low-profile design with a slight height differential between the mating modules. Its modular design allows for various configurations of rows, sloping pins, either turned or un-turned, and leads.

The IL-312-A60S-VFH05-A1 consists of two rows of pins that are designed to mate at a 90 degree angle, allowing for a sleek design that fits in tight spaces. It also utilizes a press-fit pin retention system to ensure a secure fit and prevent pin breakout. Additionally, the connector features a molded frame for increased strength and stability. The molded frame also serves to increase the transfer of heat, which is especially useful for high-power applications.

The IL-312-A60S-VFH05-A1 is typically used in board to board (mezzanine) applications. This includes but is not limited to consumer electronics, industrial electronics, and automotive applications. It is suitable for a wide range of power demands and operates at speeds of up to 3 GHz. It is also capable of handling high-speed data signals up to 6.25 Gbps.

In terms of its working principle, the IL-312-A60S-VFH05-A1 features two rows of signal pins that mate up to each other at a 90 degree angle. The pins are designed with a press-fit pin retention system that securely holds the pins in place to prevent pin breakage and ensure a reliable connection. The press-fit mechanism is also responsible for ensuring a low profile design, which allows for tight fitting in places where space is limited.

The IL-312-A60S-VFH05-A1 connector is designed with a molded frame, which is responsible for increasing strength and stability. This is especially important when dealing with high-power applications as it helps keep the connector securely attached, while also improving the heat transfer of the component. The frame is also designed to filter out EMI (Electromagnetic Interference), which is critical in applications involving high-speed data signals and wire-to-board connections.

Overall, the IL-312-A60S-VFH05-A1 is an advanced rectangular connector array that combines high-speed signal integrity, robust construction, and modular design into a single, tight fitting package. It is suitable for multi-row, right-angled board-to-board and mid-power applications, making it a great solution for applications that require high-speed, high-power connections. The connector is also capable of handling signals up to 6.25 Gbps, making it suitable for high-speed data signals and wire-to-board connections.

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