PC28F512P30BF0 Allicdata Electronics
Allicdata Part #:

PC28F512P30BF0-ND

Manufacturer Part#:

PC28F512P30BF0

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Micron Technology Inc.
Short Description: IC FLASH 512M PARALLEL 64EASYBGA
More Detail: FLASH - NOR Memory IC 512Mb (32M x 16) Parallel 52...
DataSheet: PC28F512P30BF0 datasheetPC28F512P30BF0 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Write Cycle Time - Word, Page: 100ns
Base Part Number: 28F512P30
Supplier Device Package: 64-EasyBGA (8x10)
Package / Case: 64-TBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7 V ~ 2 V
Memory Interface: Parallel
Access Time: 100ns
Series: Axcell™
Clock Frequency: 52MHz
Memory Size: 512Mb (32M x 16)
Technology: FLASH - NOR
Memory Format: FLASH
Memory Type: Non-Volatile
Part Status: Discontinued at Digi-Key
Packaging: Tray 
Description

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PC28F512P30BF0 Memory

A memory is a digital or analog storage device capable of recording, storing, and retrieving data. The PC28F512P30BF0 is an example of a type of memory that is an industry standard Flash memory solution. This memory is based on an advanced, second-generation architecture combining NAND Flash and the ARM Cortex-M3 processor core.

Application Field

The PC28F512P30BF0 memory is designed for use in embedded systems for automotive and industrial applications. Some of its common applications include sensing and signal processing, in-vehicle infotainment (IVI), automotive multimedia, automotive body controllers, and image recognition. Other applications include industrial control, robotics, industrial automation, connected home and home automation, home entertainment systems, medical instruments, and building sensors.

Working Principle

The PC28F512P30BF0 memory is powered by the ARM Cortex-M3 processor, so it has the unique ability to process data on the fly with minimal power consumption. This memory also has several programmable features that allow engineers to customize their applications for better performance. For example, the device has lock region protection, the ability to write to flash blocks, and support for in-system programming.

The PC28F512P30BF0 memory has several features that make it ideal for embedded system applications. These features include a high level of utilization, low power operations, error proofing via dual redundant ECC, and encryption for data reliability. Additionally, the device also has a flexible NAND Flash interface, which allows for low system cost implementations.

The PC28F512P30BF0 memory also has a high level of endurance and robustness, which allows the device to handle demanding conditions. This memory features an operating temperature range of -40°C to 125°C and maximum write and erase endurance of 20,000 cycles. Additionally, the chip also has a low power sleep mode, which helps to conserve energy when the memory is not being used.

The PC28F512P30BF0 memory is also a very flexible device, allowing engineers to easily configure it to meet their specific application requirements. The device can be configured with up to 8 pages of programmable Flash, up to 8 pages of SRAM, and up to 8 pages of memory mapped NAND Flash. Additionally, the processor core can be programmed to run code from either external memory or the internal Flash memory.

Overall, the PC28F512P30BF0 memory is a very versatile solution for embedded system applications. It combines the power of the ARM Cortex-M3 processor with a robust NAND Flash architecture, providing flexibility and low power operation. Additionally, the device has several programmable features that allow engineers to customize their applications for better performance.

The specific data is subject to PDF, and the above content is for reference

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