QB0402B20WYC7 Allicdata Electronics
Allicdata Part #:

QB0402B20WYC7-ND

Manufacturer Part#:

QB0402B20WYC7

Price: $ 2.56
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For 0402 Package
DataSheet: QB0402B20WYC7 datasheetQB0402B20WYC7 Datasheet/PDF
Quantity: 1000
100 +: $ 2.29887
Stock 1000Can Ship Immediately
$ 2.56
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
For Use With/Related Products: 0402 Package
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The QB0402B20WYC7 thermal heat sink belongs to the group of thermal management components. These components are made to transfer large amounts of heat from one surface of an object, into another so that no destruction or significant degradation is caused to either surface. In a variety of applications in the engineering world, these thermal management components allow for greater efficiency in cooling and heating operations.

The QB0402B20WYC7 thermal heat sink in particular is used in applications where a combination of high thermal performance and superior thermal conductivity is necessary. The QB0402B20WYC7 thermal heat sink is designed to provide the highest possible thermal performance and thermal conductivity with its specially designed, highly efficient heat sinks. The thermal heat sinks can also be used as an alternative to a fan when it comes to cooling mechanisms in applications that require extreme thermal performance.

The QB0402B20WYC7 thermal heat sink is typically made out of high-quality metals such as aluminum and copper. The heat sinks are designed with an optimized profile that is specifically engineered to maximize the heat transfer. The QB0402B20WYC7 thermal heat sink also provides a highly efficient airflow, allowing for greater levels of thermal performance. The heat sinks also have a low contact resistance, allowing for the efficient transfer of heat from the object that it is attached to.

The working principle of the QB0402B20WYC7 thermal heat sink is relatively simple. The heat sink facilitates the transfer of thermal energy from one object\'s surface to another across a thermal interface. The thermal interface is created when the surface of the heat sink is attached to the surface of the object that needs to be cooled or heated. As the heat sink is attached to the object, it begins to absorb all of the thermal energy the object emits and dissipates it into the surrounding environment.

The QB0402B20WYC7 thermal heat sink also helps to improve the heat dissipation process by using a wide range of active and passive thermal solutions. Active thermal solutions such as airflow-based fans, are typically used to provide additional cooling to the heat sink and the object that it is attached to. The passive thermal solutions, such as the copper and aluminum, are designed to improve the efficient transfer of heat from one surface to another.

The QB0402B20WYC7 thermal heat sink can be used in a variety of applications. These include applications in computers and servers, as well as in industrial, medical, and automobile industries. The heat sink is commonly used to improve the cooling and heating operations of a variety of electrical systems. The QB0402B20WYC7 thermal heat sink is also often used to dissipate heat from electrical components, such as the chip sets and processors that are commonly found in computers.

The QB0402B20WYC7 thermal heat sink is an essential component for cooling and heating operations in any engineering application where it is installed. The thermal heat sink helps to transfer high amounts of thermal energy without causing significant damage to either surface, making sure that operations are efficient and cost-effective. The QB0402B20WYC7 thermal heat sink contributes to the overall efficiency of a system by providing a high level of thermal performance and thermal conductivity.

The specific data is subject to PDF, and the above content is for reference

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