Allicdata Part #: | QB0805B40ESTB-ND |
Manufacturer Part#: |
QB0805B40ESTB |
Price: | $ 2.01 |
Product Category: | Fans, Thermal Management |
Manufacturer: | American Technical Ceramics |
Short Description: | THERMAL CONDUCTOR Q-BRIDGE |
More Detail: | Heat Director/Transfer For 0805 Package |
DataSheet: | QB0805B40ESTB Datasheet/PDF |
Quantity: | 1000 |
500 +: | $ 1.80923 |
Specifications
Series: | Q-Bridge |
Part Status: | Active |
Accessory Type: | Heat Director/Transfer |
For Use With/Related Products: | 0805 Package |
Description
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Thermal - Heat Sinks: QB0805B40ESTB Application Field and Working PrincipleHeat sinks are used to dissipate heat from electronic components, which can increase their efficiency and ensure their longevity. The QB0805B40ESTB is a thermal-heat sink designed for use with a variety of electronic components, including ICs, MOSFETs, and transistors. The QB0805B40ESTB offers superior performance and cost-efficiency, making it an ideal choice for manufacturers looking to increase the efficiency of their electronics with minimal expenditures.
The QB0805B40ESTB utilizes a state-of-the-art aluminum-core heatsink, with an optimized fin design to maximize heat dissipation. The use of aluminum for the core ensures superior thermal conductivity, resulting in better heat transfer from the component to the heatsink. Additionally, the optimized fin design increases the surface area available for heat dissipation, making for more effective cooling. The QB0805B40ESTB is designed for use with devices operating at a current from 0.1A to 10A. The heatsink features a voltage rating of 800V and a temperature range of -40°C to 85°C, making it suitable for a wide range of applications.
The working principle behind the QB0805B40ESTB heat sink is based on two core principles of thermodynamics: conduction and convection. The aluminum core of the heat sink serves as an excellent conductor of heat, transferring it away from the component at a higher rate than most other materials. This helps keep the component cooler at all times, increasing its efficiency. The fin design of the heat sink helps to further increase heat transfer, a phenomenon known as convection. This is due to the increased surface area of the fins, as more air is able to pass over them, taking heat away with it. In this way, the QB0805B40ESTB efficiently disperses heat away from the component, greatly decreasing its operating temperature and ensuring optimal performance.
The QB0805B40ESTB is an excellent heat sink for those looking to improve their electronic components’ efficiency while lowering their costs. Its optimized fin design and aluminum-core construction work together to transfer heat away from the component more quickly, ensuring cooler operation and maximum performance. The 750V voltage rating and -40°C to 85°C temperature range means that the QB0805B40ESTB can be used with a range of different devices, making it a suitable option for many manufacturers.
The specific data is subject to PDF, and the above content is for reference
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