QB1005B40ESTB Allicdata Electronics
Allicdata Part #:

QB1005B40ESTB-ND

Manufacturer Part#:

QB1005B40ESTB

Price: $ 2.01
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For
DataSheet: QB1005B40ESTB datasheetQB1005B40ESTB Datasheet/PDF
Quantity: 1000
500 +: $ 1.80923
Stock 1000Can Ship Immediately
$ 2.01
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to QB1005B40ESTB

QB1005B40ESTB is a thermal management component in the Thermal - Heat Sinks category. It is designed to provide reliable, efficient, and cost-effective thermal management solutions. It features a wide range of features including high power dissipation, compact design, and easy installation.

Applications of QB1005B40ESTB

QB1005B40ESTB is mostly used in CPU cooling, electronics cooling, and in industrial applications. It is especially suitable for high power density applications. The QB1005B40ESTB is designed to provide a wide range of thermal solutions such as cooling high power electronics, cooling servers, or cooling high power LEDs. It can also be used in a variety of high power applications such as military equipment, medical devices, or automotive cooling.

Working Principle of QB1005B40ESTB

QB1005B40ESTB uses forced convection technology to dissipate heat. This technology works by using an impeller to suck the hot air out of the system and direct it towards a heat sink, which then dissipates the heat. The heat sink is designed to reduce the surface area exposed to the air which reduces the rate of thermal transfer. This allows for efficient cooling of high power components such as ASIC and other temperature sensitive electronic components.

When QB1005B40ESTB is used in combination with other thermal management components, it can be extremely effective in reducing the total heat generated and meeting stringent thermal management requirements. This is due to its robust cooling performance and relatively low cost when compared to other thermal management solutions.

Conclusion

QB1005B40ESTB is an effective and cost-efficient thermal management solution with a wide range of applications in high power densities. It has the capability to provide efficient thermal management for high power components, as well as providing cooling solutions for servers, medical devices, and other temperature-sensitive components.

QB1005B40ESTB operates using forced convection and is an excellent choice for thermal management applications. It is a reliable thermal management solution which can be used to effectively reduce the total power consumed by the system.

The specific data is subject to PDF, and the above content is for reference

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