ATS-17E-165-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS28858-ND

Manufacturer Part#:

ATS-17E-165-C2-R0

Price: $ 3.32
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X10MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17E-165-C2-R0 datasheetATS-17E-165-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.01770
10 +: $ 2.93643
25 +: $ 2.85692
50 +: $ 2.69829
100 +: $ 2.53953
250 +: $ 2.38085
500 +: $ 2.30148
1000 +: $ 2.06339
Stock 1000Can Ship Immediately
$ 3.32
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.36°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-17E-165-C2-R0 heat sink is a thermal device that is used in many industries and applications. It is designed to transfer heat from a component or device to the surrounding environment. The ATS-17E-165-C2-R0 has a base designed to provide maximum contact with the heat source, with a heat sink which optimizes the transfer of heat to the environment. This product is highly efficient for it\'s function.

Applications of the ATS-17E-165-C2-R0

The ATS-17E-165-C2-R0 heat sink is used in many industrial, commercial and consumer applications. These applications include control cabinets, computers and other electronic equipment, electrical appliances, and power supplies. It can also be used in high-performance vehicles, process control equipment, and laboratory instrumentation. It is also suitable for attachment to LED lighting and other electromechanical components.

The ATS-17E-165-C2-R0 heat sink is also ideal for use in medical equipment such as ventilators, respirators, and medical imaging equipment. It is designed to provide excellent thermal performance under normal temperatures and is an ideal choice for applications that require reliable heat dissipation. It has also been used in the developme as well as maintenance of medical technologies such as laser therapy, ultrasound imaging, and cryotherapy.

Working Principle of the ATS-17E-165-C2-R0

The ATS-17E-165-C2-R0 heat sink has a highly efficient design which allows for the efficient transfer of heat away from the source and into the environment. This design involves the combination of two materials: a base and a heat sink. The base is typically made of aluminum or another metal alloy and is designed to provide an extremely efficient thermal conductivity. The heat sink is then attached to the base, helping to quickly dissipate the heat away from the component or device and into the atmosphere.

The base of the ATS-17E-165-C2-R0 is designed to provide maximum contact with the heat source, maximizing the thermal transfer from the source and ensuring the heat is rapidly transferred to the surrounding environment. The heat sink absorbs the heat and dissipates it into the atmosphere. This overall design helps to ensure optimal thermal performance of the ATS-17E-165-C2-R0 heat sink in all applications.

Conclusion

The ATS-17E-165-C2-R0 heat sink is a highly effective thermal device that is used in many industrial, commercial and consumer applications. It is designed to provide efficient heat transfer from the component or device to the surrounding environment and is ideal for applications that require reliable heat dissipation. It has a design that involves a base and a heat sink which transfer the heat away from the source and efficiently into the atmosphere. As such, the ATS-17E-165-C2-R0 heat sink is the perfect choice for many applications and industries.

The specific data is subject to PDF, and the above content is for reference

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