ATS-12F-204-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.41°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-12F-204-C1-R0 Thermal – Heat SinksHeat sinks are used to dissipate heat away from components to ensure that the components do not overheat and cause damage. Heat sinks use thermal conductors to transfer heat from one area to another that is better able to dissipate it. The ATS-12F-204-C1-R0 Thermal – Heat sink is a specific model of heat sink designed for use in electronic components and systems.Application of the ATS-12F-204-C1-R0 Thermal – Heat SinkThe ATS-12F-204-C1-R0 is a compact and lightweight heat sink designed for use in a variety of applications. It is designed to be used in applications where space is at a premium, such as in laptops, tablets, and other thin and small devices. The heat sink is also designed to be used in larger, traditional devices where characteristics such as noise levels, power consumption, and mechanical constraints are of significant concern.Working Principle of the ATS-12F-204-C1-R0 Thermal – Heat SinkThe ATS-12F-204-C1-R0 Thermal – Heat Sink uses a thermal conductive plate to transfer heat away from the components it is protecting. The heat sink is made up of three components: a base plate, a radiator plate, and a fin-like tube. The heat produced by the components is transferred via conduction through the base plate into the radiator plate, which then dissipates the heat via convection. The fin-like tube is then used to further dissipate the heat by drawing air across the surface of the radiator plate as it moves over the tube.Advantages of the ATS-12F-204-C1-R0 Thermal – Heat SinkThe ATS-12F-204-C1-R0 Thermal – Heat Sink offers a number of advantages. Its design is both lightweight and compact, making it ideal for a variety of size-restricted applications. The fins on the tube allow for increased surface area for air to move across, making the heat dissipation process more efficient. The design also ensures that the noise produced by the heat sink is minimal, allowing for quieter operations.ConclusionThe ATS-12F-204-C1-R0 Thermal – Heat Sink is an effective and efficient heat sink designed for use in a variety of applications. Its lightweight and compact design make it ideal for smaller, size-restricted devices, while its fins allow for increased surface area for air to move across for efficient heat dissipation. The noise level of the heat sink is also minimal, allowing for quieter operations.

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