QTE-060-04-H-D-K

Series:	Q Strip® QTE
Packaging:	Bulk
Part Status:	Active
Connector Type:	Header, Outer Shroud Contacts
Number of Positions:	120
Pitch:	0.031" (0.80mm)
Number of Rows:	2
Mounting Type:	Surface Mount
Features:	Ground Bus (Plane), Pick and Place
Contact Finish:	Gold
Contact Finish Thickness:	30.0µin (0.76µm)
Mated Stacking Heights:	16mm
Height Above Board:	0.600" (15.24mm)

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The QTE-060-04-H-D-K is a type of mezzanine board to board arrays that are vertical edge connectors. This particular type comes with four board mount orientation (H), four position counts (D), and stack heights (H) of 0.600" (15,24 mm).This rectangular connector has a two-sided array with a double sided hermetic seal which helps protect the contacts from dust, dirt, and moisture. Its useful for applications that require high levels of protection against environment.Physically, the edge can be used with any variation of 0.600" (15.24 mm) stack, which has eight standard rows and brings out to a mating line. The board edge is designed to achieve a controlled impedance and mate with standard high-density headers.The board mount orientation offers a variety of options such as vertical, horizontal, top- and side-entry. This allows for greater flexibility in installation while providing strong guidance in mating. Its rear keyed locking lugs ensure proper orientation and locking together of boards when mated.The gold-plated contacts are arranged in four rows with a 1/2" spacing. They provide a reliable connection that helps to reduce EMI/RFI interference when in use and helps to increase the speed of signal flow. The board to board array also features a maximum current carrying capacity of 5 Amps.In terms of applications, the QTE-060-04-H-D-K is suitable for high speed, high density, and high current applications such as edge-mounted board-to-board systems in computing, communication, and I/O applications. They are especially useful in environments that require extra environmental protection or require space-savings.As for its working principle, these arrays are designed to reduce troublesome mating forces by relying on double row contact design. They can be configured to achieve several degrees of keying and coding that helps ensure correct mating. The double sided hermetic seal has mechanical deformation which helps secure the contact mating during assembly.The angled mating pads on the surface of the board helps to reduce wave soldering time and cost. The contacts are maintained in place by a silver-plated stainless steel frame which helps to reduce misalignment and maintenance requirements. In addition, the framed construction also provides a ground layer between the mating layers which helps promote accurate impedance levels.Overall, the QTE-060-04-H-D-K is a mezzanine board-to-board array with high levels of protection against the environment as well as high speed, high density, and high current applications. Its design helps to reduce troublesome mating forces and promote a reliable connection. The double sided hermetic seal and silver-plated stainless steel frame helps reduce misalignment and maintenance requirements while allowing for ease of assembly. Through its edge-mounted design, the QTE-060-04-H-D-K can provide a small form factor for space-savings on the board.

The specific data is subject to PDF, and the above content is for reference