25-78FSV50-BD-24 Allicdata Electronics

25-78FSV50-BD-24 RF/IF and RFID

Allicdata Part #:

25-78FSV50-BD-24-ND

Manufacturer Part#:

25-78FSV50-BD-24

Price: $ 13.36
Product Category:

RF/IF and RFID

Manufacturer: Leader Tech Inc.
Short Description: 0.25 X 0.78 X 0.50 BD 24--FOLDED
More Detail: N/A
DataSheet: 25-78FSV50-BD-24 datasheet25-78FSV50-BD-24 Datasheet/PDF
Quantity: 1000
20 +: $ 12.14320
Stock 1000Can Ship Immediately
$ 13.36
Specifications
Series: --
Part Status: Active
Type: Fingerstock
Shape: --
Width: 0.780" (19.81mm)
Length: 24.000" (609.60mm)
Height: 0.250" (6.35mm)
Material: Beryllium Copper
Plating: Unplated
Plating - Thickness: --
Attachment Method: Adhesive
Operating Temperature: -55°C ~ 121°C
Description

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The 25-78FSV50-BD-24, a contact, fingerstock, and gasket part, is an important component in a range of electronics. This small yet powerful part has a number of applications in both Radio Frequency Interference (RFI) and ElectroMagnetic Interference (EMI) technology. Understanding the 25-78FSV50-BD-24’s uses and its general working principles can help to optimize its use in a variety of modern electronic systems.

At its core, the 25-78FSV50-BD-24 is a fingerstock-based part, made up of interlocking metal leaves that fit together. Each leaf is covered in gold plating, which is important in electronics for transmitting unimpeded signal. This gold plating is slotted and curved in order to create a number of contact points which are then joined together to create a complete circuit. This multi-layered construction is what provides the 25-78FSV50-BD-24 with one of its primary functions: its ability to act as a contact while providing a high level of electrical insulation.

The 25-78FSV50-BD-24 is a popular part for both RFI and EMI applications due to its unique construction. Its gold-plated contact connections provide not only the required electrical insulation but also a way to reduce radio noise and prevent signal interference. This is due to its ability to block signals from other parts and channels, effectively creating a radio shield that ensures the free flow of data from one part to another. It is for this reason that the 25-78FSV50-BD-24 is primarily used in electronics for high-frequency signal transmissions.

The 25-78FSV50-BD-24 is also used to supplement the operation of other parts in EMI and RFI applications. Its gold plating works to absorb and conduct any stray electrical signals, protecting other parts from overloads or crippling signal noise. In addition, its multi-layered structure and contact points also provide an additional air gap, which can further reduce interference from other parts that may be in close proximity.

The 25-78FSV50-BD-24 can also provide increased durability in certain applications. This is because it is designed to withstand a number of environmental conditions, including temperature extremes, chemical exposure, and even shock and vibration. This durability, combined with its electrical insulation capabilities, make the 25-78FSV50-BD-24 an invaluable component in a variety of electronics.

The 25-78FSV50-BD-24 is a key part in RFI and EMI applications. It is important to understand its working principles in order to take full advantage of its capabilities. In general, the 25-78FSV50-BD-24 is a gold-plated contact with a multi-layered construction that provides electrical insulation while blocking signals from other parts. This allows the part to reduce radio noise and prevent signal interference, and also serves as an additional air gap to further reduce interference from other parts. Finally, its high durability also makes it an invaluable component in a number of electronics.

The specific data is subject to PDF, and the above content is for reference

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