HM2S70PE5100N9 Allicdata Electronics
Allicdata Part #:

HM2S70PE5100N9-ND

Manufacturer Part#:

HM2S70PE5100N9

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN RECEPT 110POS TYPE B VERT
More Detail: 110 Position Receptacle, Female Sockets Connector ...
DataSheet: HM2S70PE5100N9 datasheetHM2S70PE5100N9 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: Millipacs®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Type: Receptacle, Female Sockets
Connector Style: B 22
Number of Positions: 110
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1.5A
Voltage Rating: 500V
Operating Temperature: -55°C ~ 125°C
Features: --
Description

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Backplane connectors are electric connectors used to interconnect multiple printed circuit boards (PCBs) to create an electrical assembly known as a backplane. The HM2S70PE5100N9 Backplane Connector is a type of hard metric, standard connector. In this article, we\'ll explore the application fields and working principle of the HM2S70PE5100N9.

Application Fields

The HM2S70PE5100N9 Backplane Connector is most commonly used for applications such as networking equipment, data storage, and telecommunications. The device is designed to optimize the performance of networking equipment and data storage systems, as well as to facilitate the transmission of data. The high-density nature of the HM2S70PE5100N9 makes it suitable for applications requiring a high number of connections per connector.

The device is also popular in the automotive industry due to its ability to be easily integrated with existing infrastructures. It also helps reduce wiring complexity and costs, as well as providing robust transmission performance. The HM2S70PE5100N9 Backplane Connector is also suitable for applications such as industrial automation, medical equipment, and consumer electronics.

Working Principle

The HM2S70PE5100N9 Backplane Connector is designed for a secure, reliable connection between two PCBs. It utilizes two different types of hard metric contacts, standard and reversed. The standard contacts feature a minimum contact pressure of 0.5 N and contact spacing of 2.5 mm for a secure connection. On the other hand, the reversed contacts feature a minimum contact pressure of 0.5 N and contact spacing of 1.5 mm for a robust connection. The device also utilizes a push-lock system which provides a strong, secure connection between the PCBs.

The HM2S70PE5100N9 Backplane Connector is designed with a locking mechanism which ensures a secure, reliable connection between the two PCBs. The device is also designed to provide a stable and reliable data-transmission performance. Furthermore, the device also utilizes a latching system for inserting and removing the connector quickly and easily. The latching system also ensures the connector cannot be accidentally disconnected.

The HM2S70PE5100N9 Backplane Connector is designed with a low-profile design which allows for a secure connection of the backplane to the circuit board without obstructing the rear of the board. This makes it ideal for space-constrained applications. The device also utilizes a high-temperature thermoplastic which is designed to withstand temperatures up to 105°C. This ensures a reliable, long-lasting connection.

Conclusion

The HM2S70PE5100N9 Backplane Connector is a hard metric, standard connector designed to provide a secure, reliable connection between two PCBs. The device is suitable for applications such as networking equipment, data storage, and telecommunications. It utilizes two different types of contacts, standard and reversed, with a minimum contact pressure of 0.5 N and contact spacing of 2.5 mm and 1.5 mm respectively. The device also utilizes a latching and locking mechanism to ensure a secure connection. The device is also designed to provide a stable and reliable data-transmission performance. In addition, the device utilizes a high-temperature thermoplastic to withstand temperatures up to 105°C. The device is designed with a low-profile design which allows for a secure connection of the backplane to the circuit board without obstructing the rear of the board. This makes it ideal for space-constrained applications.

The specific data is subject to PDF, and the above content is for reference

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